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參數(shù)資料
| 型號： | TSEV8388BGLZA2 |
| 廠商： | Atmel Corp. |
| 元件分類： | ADC |
| 英文描述： | ADC 8-bit 1 GSPS |
| 中文描述： | ADC的8位1 GSPS的 |
| 文件頁數(shù)： | 47/57頁 |
| 文件大?。?/td> | 1276K |
| 代理商： | TSEV8388BGLZA2 |
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47
TS8388B
2144C–BDC–04/03
Enhanced CQFP68
Thermal
Characteristics
Enhanced CQFP68
The CQFP68 has been modified, in order to improve the thermal characteristics:
A CuW heatspreader has been added at the bottom of the package.
The die has been electrically isolated with the ALN substrate.
Thermal Resistance
from Junction to
Case: RTHJC
Typical value for Rthjc is given to 1.56
°
C/W.
This value does not include thermal contact resistance between package and external compo-
nent (heatsink or PCBoard).
As an example, 2.0
°
C/W can be taken for 50 μm of thermal grease.
Heatsink
It is recommended to use an external heatsink, or PCBoard special design.
The stand off has been calculated to permit the simultaneous soldering of the leads and of the
heatspreader with the solder paste.
Figure 52.
Enhanced CQFP68 Suggested Assembly
Cooling system efficiency can be monitored using the Temperature Sensing Diode, integrated
in the device.
Printed
circuit board
CuW heatspreader
28.78
Thermal via
Solid ground plane
24.13
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