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參數(shù)資料
| 型號： | TSEV8388BFZA2 |
| 廠商： | Atmel Corp. |
| 元件分類： | ADC |
| 英文描述： | ADC 8-bit 1 GSPS |
| 中文描述： | ADC的8位1 GSPS的 |
| 文件頁數(shù)： | 44/57頁 |
| 文件大小： | 1276K |
| 代理商： | TSEV8388BFZA2 |
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44
TS8388B
2144C–BDC–04/03
CBGA68 Board
Assembly with
External Heasink
It is recommended to use an external heatsink or PCBoard special design.
Cooling system efficiency can be monitored using the Temperature Sensing Diode, integrated
in the device.
Figure 49.
CBGA68 Board Assembly
Moisture
Characteristics
This device is sensitive to the moisture (MSL3 according to JEDEC standard):
Shelf life in sealed bag: 12 months at <40
°
C and <90% relative humidity (RH).
After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow,
or equivalent processing (peak package body temperature 220
°
C) must be:
mounted within 198 hours at factory conditions of
≤
30
°
C/60% RH, or
stored at
≤
20% RH.
Devices require baking, before mounting, if Humidity Indicator Card is >20% when read at
23
°
C ±5
°
C.
If baking is required, devices may be baked for:
192 hours at 40
°
C +5
°
C/-0
°
C and <5% RH for low-temperature device containers, or
24 hours at 125
°
C ±5
°
C for high temperature device containers.
31
32.5
Board
50.5
20.2
24.2
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