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| 型號： | TSC83251G2D-16CB |
| 廠商： | Atmel Corp. |
| 英文描述： | B/16-BIT MICROCONTROLLER WITH SERIAL COMMUNICATION INTERFACES |
| 中文描述： | B/16-BIT微控制器串行通信接口 |
| 文件頁數(shù)： | 2/28頁 |
| 文件大小： | 153K |
| 代理商： | TSC83251G2D-16CB |
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Qualpack TSC87251G2D
2 Rev 0 – October 1999
1. General Information...........................................................................................................................3
1.1 Product Description............................................................................................................................3
2. Technology Information.....................................................................................................................4
2.1 Wafer Process Technology.................................................................................................................4
2.1.1 SCMOS3 0.5um ROM Process ...................................................................................................4
2.1.2 SCMOS3 NV 0.5um EPROM Process .........................................................................................6
2.2 Product Design ..................................................................................................................................6
2.3 Package Technology..........................................................................................................................6
2.3.1 Package description...................................................................................................................6
2.3.2 Other available packages............................................................................................................7
2.4 Test ..................................................................................................................................................7
2.5 Device Cross Section.........................................................................................................................8
2.6 Wafer Process Control........................................................................................................................9
3. Qualification ....................................................................................................................................10
3.1 Change Procedure...........................................................................................................................11
3.2 Qualification Flow.............................................................................................................................12
3.3 Wafer Process Qualification..............................................................................................................13
3.3.1 Process Module Reliability........................................................................................................13
3.3.1.1 Hot carrier qualification..............................................................................................................................................13
3.3.1.2 Electromigration..........................................................................................................................................................15
3.3.1.3 Time Dependent Dielectric Breakdown..................................................................................................................16
3.3.2 Z92 Wafer Process Qualification Results ...................................................................................18
3.3.3 Z94 Wafer Process Qualification Results ...................................................................................19
3.4 Package Qualification.......................................................................................................................20
3.5 Device Qualification..........................................................................................................................20
3.5.1 Failure Mechanisms and Corrective Actions ...............................................................................21
3.5.2 Qualification status ...................................................................................................................21
3.6 Outgoing Quality and Reliability ........................................................................................................22
3.6.1 AOQ (Average Outgoing Quality)...............................................................................................22
3.6.2 EFR (Early Failure Rate)...........................................................................................................22
3.6.3 LFR (Latent Failure Rate)..........................................................................................................23
4. User Information..............................................................................................................................24
4.1 Soldering Recommendations ............................................................................................................24
4.2 DRY PACK Ordering rules................................................................................................................24
4.3 ESD caution.....................................................................................................................................24
5. Environmental Information ..............................................................................................................25
6. Other Data........................................................................................................................................26
6.1 ISO9001 Approval Certificate............................................................................................................26
6.2 Databook Reference........................................................................................................................27
6.3 Address Reference...........................................................................................................................27
7. Revision History...............................................................................................................................28
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| TSC83251G2D-24CB | B/16-BIT MICROCONTROLLER WITH SERIAL COMMUNICATION INTERFACES |
| TSC83251G2D-24IA | B/16-BIT MICROCONTROLLER WITH SERIAL COMMUNICATION INTERFACES |
| TSC83251G2D-24IB | B/16-BIT MICROCONTROLLER WITH SERIAL COMMUNICATION INTERFACES |
| TSC87251G2D-24CED | B/16-BIT MICROCONTROLLER WITH SERIAL COMMUNICATION INTERFACES |
| TSC83251G2D-24CED | B/16-BIT MICROCONTROLLER WITH SERIAL COMMUNICATION INTERFACES |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TSC87251 | 制造商: 功能描述: 制造商:undefined 功能描述: |
| TSC87251G2D-16CB | 功能描述:IC MCU 8BIT 32K OTP 16MHZ 44PLCC RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:8x251 標準包裝:9 系列:87C 核心處理器:8051 芯體尺寸:8-位 速度:40/20MHz 連通性:UART/USART 外圍設(shè)備:POR，WDT 輸入/輸出數(shù):32 程序存儲器容量:32KB（32K x 8） 程序存儲器類型:OTP EEPROM 大小:- RAM 容量:256 x 8 電壓 - 電源 (Vcc/Vdd):4.5 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:內(nèi)部 工作溫度:0°C ~ 70°C 封裝/外殼:40-DIP（0.600"，15.24mm） 包裝:管件 |
| TSC87251G2D-16CBR | 功能描述:IC MCU 8BIT 32K OTP 16MHZ 44PLCC RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:8x251 標準包裝:1,500 系列:AVR® ATtiny 核心處理器:AVR 芯體尺寸:8-位 速度:16MHz 連通性:I²C，LIN，SPI，UART/USART，USI 外圍設(shè)備:欠壓檢測/復(fù)位，POR，PWM，溫度傳感器，WDT 輸入/輸出數(shù):16 程序存儲器容量:8KB（4K x 16） 程序存儲器類型:閃存 EEPROM 大小:512 x 8 RAM 容量:512 x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 11x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:20-SOIC（0.295"，7.50mm 寬） 包裝:帶卷 (TR) |
| TSC87251G2D-24CB | 功能描述:IC C251 MCU OTPROM 32K 44PLCC RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:8x251 標準包裝:1,500 系列:AVR® ATtiny 核心處理器:AVR 芯體尺寸:8-位 速度:16MHz 連通性:I²C，LIN，SPI，UART/USART，USI 外圍設(shè)備:欠壓檢測/復(fù)位，POR，PWM，溫度傳感器，WDT 輸入/輸出數(shù):16 程序存儲器容量:8KB（4K x 16） 程序存儲器類型:閃存 EEPROM 大小:512 x 8 RAM 容量:512 x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 11x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:20-SOIC（0.295"，7.50mm 寬） 包裝:帶卷 (TR) |
| TSC87251G2D-24CE | 功能描述:IC C251 MCU OTPROM 32K 44VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:8x251 標準包裝:1,500 系列:AVR® ATtiny 核心處理器:AVR 芯體尺寸:8-位 速度:16MHz 連通性:I²C，LIN，SPI，UART/USART，USI 外圍設(shè)備:欠壓檢測/復(fù)位，POR，PWM，溫度傳感器，WDT 輸入/輸出數(shù):16 程序存儲器容量:8KB（4K x 16） 程序存儲器類型:閃存 EEPROM 大小:512 x 8 RAM 容量:512 x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 11x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:20-SOIC（0.295"，7.50mm 寬） 包裝:帶卷 (TR) |
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