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參數(shù)資料
| 型號： | TSA5059T |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | XO, clock |
| 英文描述： | 2.7 GHz I2C-bus controlled low phase noise frequency synthesizer |
| 中文描述： | PLL FREQUENCY SYNTHESIZER, 2700 MHz, PDSO16 |
| 封裝： | 3.90 MM, PLASTIC, MS-102, SOT-109-1, SOP-16 |
| 文件頁數(shù)： | 21/24頁 |
| 文件大小： | 151K |
| 代理商： | TSA5059T |
1999 Oct 05
21
Philips Semiconductors
Preliminary specification
2.7 GHz I
2
C-bus controlled low phase
noise frequency synthesizer
TSA5059
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TSA5059TS | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:2.7 GHz I2C-bus controlled low phase noise frequency synthesizer |
| TSA5060A | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:1.3 GHz I2C-bus controlled low phase noise frequency synthesizer |
| TSA5060AT | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:1.3 GHz I2C-bus controlled low phase noise frequency synthesizer |
| TSA5060AT/C1,518 | 功能描述:IC SYNTH FREQ 1.3GHZ 16-SOIC RoHS:是 類別:集成電路 (IC) >> 時鐘/計時 - 時鐘發(fā)生器，PLL，頻率合成器 系列:- 產(chǎn)品變化通告:Product Discontinuation 04/May/2011 標(biāo)準(zhǔn)包裝:96 系列:- 類型:時鐘倍頻器，零延遲緩沖器 PLL:帶旁路 輸入:LVTTL 輸出:LVTTL 電路數(shù):1 比率 - 輸入:輸出:1:8 差分 - 輸入:輸出:無/無 頻率 - 最大:133.3MHz 除法器/乘法器:是/無 電源電壓:3 V ~ 3.6 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:16-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:16-TSSOP 包裝:管件 其它名稱:23S08-5HPGG |
| TSA5060AT/C2,118 | 制造商:NXP Semiconductors 功能描述: |
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