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參數(shù)資料
| 型號： | TS820-700T-TR |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | 8A SCRs |
| 中文描述： | 8A條可控硅 |
| 文件頁數(shù)： | 5/9頁 |
| 文件大小： | 162K |
| 代理商： | TS820-700T-TR |
TN8, TS8 and TYNx08 Series
5/9
Fig. 3-2:
Relative variation of thermal impedance
junction to ambient versus pulse duration
(recommended pad layout, FR4 PC board for
DPAK).
Fig. 4-1:
Relative variation of gate trigger current
and holding current versus junction temperature
for TS8 series.
Fig. 4-2:
Relative variation of gate trigger current
and holding current versus junction temperature
for TN8 & TYN series.
Fig. 5:
Relative variation of holding current
versus gate-cathode resistance (typical values)
for TS8 series.
Fig. 6:
Relative variation of dV/dt immunity
versus gate-cathode resistance (typical values)
for TS8 series.
Fig. 7:
Relative variation of dV/dt immunity
versus gate-cathode capacitance (typical values)
for TS8 series.
1E-2
1E-1
1E+0
1E+1
1E+2
5E+2
0.01
0.10
1.00
K = [Zth(j-a)/Rth(j-a)]
DPAK
TO-220AB
tp(s)
-40
-20
0
20
40
60
80
100
120
140
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
IGT,IH,IL [Tj] / IGT,IH,IL [Tj = 25°C]
IGT
IH & IL
Tj(°C)
-40
-20
0
20
40
60
80
100
120
140
0.0
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
IGT,IH,IL [Tj] / IGT,IH,IL [Tj = 25°C]
IGT
IH & IL
Tj(°C)
IH[Rgk] / IH[Rgk = 1k ]
Rgk(k )
Rgk(k )
dV/dt[Rgk] / dV/dt [Rgk = 220 ]
0
20
40
60
80 100 120 140 160 180 200 220
0.0
2.5
5.0
7.5
10.0
12.5
15.0
VD Tj = 125°C
Rgk = 220
dV/dt[Cgk] / dV/dt [Rgk = 220
]
Cgk(nF)
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