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TS68EN360
2113A–HIREL–03/02
SoftwareCompatibilityIssues
ThefollowinglistsummarizesthemajorsoftwaredifferencesbetweentheTS68302and
theQUICC:
SincetheCPU32+isasupersetofthe68000instructionset,allpreviouslywritten
codewillrun.However,ifsuchcodeisaccessingtheTS68302peripherals,itwill
requiresomemodification.
TheQUICCcontainsan8-Kbyteblockofmemoryasopposedtoa4-Kbyteblockon
theTS68302.Theregisteraddresseswithinthatmemorymaparedifferent.
ThecodeusedtoinitializethesystemintegrationfeaturesoftheTS68302hastobe
modifiedtowritethecorrespondingfeaturesontheQUICCSIM60.
Asmuchaspossible,QUICCCPMfeaturesweremadeidenticaltothoseofthe
TS68302CP.Themostimportantbenefitisthatthecodeflow(ifnotthecodeitself)
willporteasilyfromtheTS68302totheQUICC.Thenuanceslearnedfromthe
TS68302willstillbeusefulintheQUICC.
AlthoughtheregistersusedtoinitializetheQUICCCPMarenew(forexample,the
SCMontheTS68302isreplacedwiththeGSMRandPSMRontheQUICC),most
registersretaintheiroriginalpurposesuchastheSCCevent,SCCmask,SCC
status,andcommandregisters.TheparameterRAMoftheSCCsisverysimilar,
andmostparameterRAMregisternamesandusageareretained.Moreimportantly,
thebasicstructureofabufferdescriptor(BD)ontheQUICCisidenticaltothatofthe
TS68302,exceptforafewnewbitfunctionsthatwereadded.(Inafewcases,abit
inaBDstatuswordhadtobeshifted.)
WhenportingcodefromtheTS68302CPtotheQUICCCPM,thesoftwarewriter
mayfindthattheQUICChasnewoptionstosimplifywhatusedtobeamorecode-
intensiveprocess.Forspecificexamples,seetheINITTXANDRXPARAMETERS,
GRACEFULSTOPTRANSMIT,andCLOSEBDcommands.
Preparationfor
Delivery
Packaging
MicrocircuitsarepreparedfordeliveryinaccordancewithMIL-PRF-38535orAtmel
standards.
CertificateofCompliance
Atmeloffersacertificateofcomplianceswitheachshipmentofparts,affirmingtheprod-
uctsareincomplianceeitherwithMIL-STD-883orAtmelstandardandguarantyingthe
parametersnottestedattemperatureextremesfortheentiretemperaturerange.
Handling
MOSdevicesmustbehandledwithcertainprecautionstoavoiddamageduetoaccu-
mulationofstaticcharge.Inputprotectiondeviceshavebeendesignedinthechipto
minimizetheeffectofthisstaticbuildup.However,thefollowinghandlingpracticesare
recommended:
a) Devicesshouldbehandledonbencheswithconductiveandgroundedsurfaces.
b) Groundtestequipment,toolsandoperator.
c) Donothandledevicesbytheleads.
d) Storedevicesinconductivefoamorcarriers.
e) Avoiduseofplastic,rubber,orsilkinMOSareas.
f) Maintainrelativehumidityabove50%ifpractical.