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參數(shù)資料
| 型號： | TRCV0110G |
| 英文描述： | ATM/SONET DEMULTIPLEXER|BIPOLAR|BGA|177PIN|PLASTIC |
| 中文描述： | 的ATM / SONET的分路器|雙極|的BGA | 177PIN |塑料 |
| 文件頁數(shù)： | 23/26頁 |
| 文件大小： | 476K |
| 代理商： | TRCV0110G |
Agere Systems Inc.
23
Data Sheet
March 28, 2002
Clock Recovery, 1:16 Data Demultiplexer
TRCV0110G 10 Gbits/s Limiting Amplifier
Packaging Characteristics
(continued)
Assembly Information
Note:
Each assembly process will have its own idiosyncrasies, due to product design, materials differences and
equipment variations. Assembly information provided here is a beginning point from which the assembly
process engineer should apply their knowledge and experience to obtain optimal results.
It is recommended that the stencil thickness be set at 0.006 in. for a starting point. After trials with the recom-
mended stencil opening size, stencil thickness, and process specific solder paste, a visual inspection should be
done to assure a proper fillet and wetting is obtained for each ball. The reflowed solder fillet should resemble a
cylindrical column from the PWB to the center of the ball.
The reflow profile should be determined using a known set point for the oven such as the Joint Electron Device
Engineering Council (JEDEC) profile. The JEDEC profile is defined as the following parameters:
Table 20. JEDEC Profile
Belt speed = 28 in./min.
A representative sample of the product (fitted with multiple thermocouples and a data logger) should be run
through the oven to determine the optimum profile. The temperature of the CBGA device should not exceed
225 °C, and only be above the liquidus of the solder alloy (typically 180 °C) for less than 60 s.
Reference Materials
For further information, the user may wish to consult some of the many references that are available on the techni-
cal market today for CBGA assembly. The following are suggested for more detailed information, but there are
many others too:
I
Ceramic Ball Grid Array Surface Mount Assembly and Rework
, IBM Document #APD-SBSC-101.0, Cindy Milk-
ovich, Lisa Jimarez, IBM Corporation, 1701 North Street, Endicott, NY 13760, (800) 925-3157
I
Ball Grid Array Technology
, John Lau (Editor), ISBN 0-07-036608-X, McGraw-Hill, Inc., 1221 Avenue of the
Americas, New York, NY 10020
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