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參數(shù)資料
| 型號： | TQRLC |
| 廠商： | TriQuint Semiconductor,Inc. |
| 英文描述： | Advanced Passives Foundry Service |
| 中文描述： | 先進的無源代工服務 |
| 文件頁數(shù)： | 1/3頁 |
| 文件大?。?/td> | 397K |
| 代理商： | TQRLC |
Released Process
Production Process
TQTRx
TQRLC
Advanced Passives Foundry Service
www.triquint.com
TriQuint Semiconductor
Hillsboro, Oregon 97124
Hillsboro, Oregon 97124
Email: info@triquint.com
Page 1 of 7; Rev 1.0 11/15/01
Page 1 of 3; Rev 2.3 3/18/04
TQTRx Process Cross-Section
TQRLC Process Cross-Section
Features
Thick 4 Layer Metal; > 9 μm total
thickness
High Density Interconnects:
3 Global
1 Local
High-Q Passives; Inductor Q >50
@ 2 GHz
Low Cost: Passives Only
Thin Film Resistors
Dielectric Encapsulated Metals
Planarized Surface;
simplified plastic packaging
Volume Production Process
Applications
Passive Components:
Phase Shifters
Baluns
Transformers
Couplers
Mixers
(with off-chip di-
ode arrays)
Circuits Requiring High-Q
Passive Elements
Matching Circuits
RF Module Front-End Filters
General RF and Microwave Imped-
ance Matching
General Description
TriQuint’s TQRLC is a pure passives process. It is targeted at
high performance, small size passive-only circuits and utilizes
over 9 μm of gold metal. High density interconnections are ac-
complished with three thick global and one surface metal inter-
connect layers. The four metal layers are encapsulated in a high
performance, low dielectric constant material that allows wiring
flexibility and plastic packaging simplicity. Precision NiCr resis-
tors, inductors, and high value MIM capacitors are available.
The process is based on the TQTRx process, currently
TriQuint’s highest volume process. The TQRLC process is
available on 150-mm (6 inch) wafers.
Semiconductors for Communications
2300 NE Brookwood Pkwy
2300 NE Brookwood Pkwy
PhFax: 503-615-8905
Fax: 503-615-8905
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