參數(shù)資料
型號: TPS65131RGE
廠商: Texas Instruments, Inc.
元件分類: DC/DC變換器
英文描述: POSITIVE AND NEGATIVE OUTPUT DC-DC CONVERTER
中文描述: 正負輸出電壓的DC - DC轉換器
文件頁數(shù): 27/29頁
文件大小: 550K
代理商: TPS65131RGE
www.ti.com
RGE (S-PQFP-N24)
THERMAL INFORMATION
THERMAL PAD MECHANICAL DATA
Exposed Thermal Pad Dimensions
QFND025
NOTE: All linear dimensions are in millimeters
Bottom View
Exposed Thermal Pad
7
12
24
19
1
6
18
13
This package incorporates an exposed thermal pad that is designed to be attached directly to an external
heatsink. The thermal pad must be soldered directly to the printed circuit board (PCB). After soldering, the PCB
can be used as a heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly
to a ground plane or special heatsink structure designed into the PCB. This design optimizes the heat transfer
from the integrated circuit (IC).
For additional information on the Quad Flatpack No-Lead (QFN) package and how to take advantage of its heat
dissipating abilities, refer to Application Report,
Quad Flatpack No-Lead Logic Packages
, Texas Instruments
Literature No. SCBA017 and Application Report,
56-Pin Quad Flatpack No-Lead Logic Package
, Texas
Instruments Literature No. SCEA032. Both documents are available at www.ti.com.
The exposed thermal pad dimensions for this package are shown in the following illustration.
+0,10
0,15
2,45
+0,10
0,15
2,45
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