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DESCRIPTION (CONTINUED)
The converter operates with a fixed frequency PWM control topology and, if power-save mode is enabled, it uses
a pulse-skipping mode at light load currents. It operates with only 500-μA device quiescent current. Independent
enable pins allow power up and power down sequencing for both outputs. The device has an internal current
limit overvoltage protection and a thermal shutdown for highest reliability under fault conditions.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
DISSIPATION RATINGS TABLE
(1)
TPS65130, TPS65131
SLVS493B–MARCH 2004–REVISED SEPTEMBER 2004
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION
T
A
SWITCH CURRENT LIMIT
BOOST CONVERTER
PART NUMBER
(1)
INVERTING CON-
VERTER
800 mA
1950 mA
–40
°
C to 85
°
C
–40
°
C to 85
°
C
800 mA
1950 mA
TPS65130RGE
TPS65131RGE
(1)
The RGE package is availabletaped and reeled. Add an R suffix to the device type (i.e.,
TPS65130RGER) toorder quantities of 3000 devices per reel. It is also available in minireels. Add a T
suffix to the device type (i.e., TPS65130RGET) toorder quantities of 250 devices per reel.
TPS65130/1
–0.3 V to +6.0 V
17 V
–17 V
–0.3 V to V
IN
+ 0.3 V
17 V
24 V
–40
°
C to 150
°
C
–65
°
C to 150
°
C
VIN, INN
VPOS
VNEG
Input voltage range at pins
(2)
Maximum voltage at pin
(2)
Minimum voltage at pin
(2)
Voltage at pins ENN, ENP, FBP, FBN, CN, CP, PSP, PSN, BSW
(2)
Input voltage at pin
(2)
Differential voltage between pins OUTN to V
INN(2)
Operating virtual junction temperature
Storage temperature range
INP
T
J
T
STG
(1)
Stresses beyond those listedunder "absolute maximum ratings” may cause permanent damage to thedevice. These are stress ratings
only, and functional operation of the deviceat these or any other conditions beyond those indicated under "recommendedoperating
conditions” is not implied. Exposure to absolute-maximum-ratedconditions for extended periods may affect device reliability.
All voltage values are withrespect to network ground terminal, unless otherwisenoted.
(2)
DERATING FACTOR
ABOVE T
A
= 25
°
C
T
= 70
°
C
POWER RATING
T
= 85
°
C
POWER
RATING
1058 mW
T
≤
25
°
C
POWER RATING
PACKAGE
Θ
JA
Θ
JB
Θ
JC
RGE
37.8
°
C/W
27.8
°
C/W
57.9
°
C/W
2646 mW
26 mW/
°
C
1455 mW
(1)
This thermal data is based on assembly of the device on a JEDEC high K board. The PowerPAD must be soldered on a pad on the
board. There must be vias within the pad that contact the ground plane in the PCB. Exceeding the maximum junctiontemperature will
force the device into thermalshutdown.
2