參數(shù)資料
型號: TPS54519RTER
廠商: TEXAS INSTRUMENTS INC
元件分類: 穩(wěn)壓器
英文描述: 8 A SWITCHING REGULATOR, 2000 kHz SWITCHING FREQ-MAX, PQCC16
封裝: 3 X 3 MM, GREEN, PLASTIC, WQFN-16
文件頁數(shù): 12/33頁
文件大?。?/td> 1269K
代理商: TPS54519RTER
SLVSAT3
– SEPTEMBER 2011
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
TJ
PACKAGE
PART NUMBER
–40°C to 140°C
3
× 3 mm QFN
TPS54519RTE
ABSOLUTE MAXIMUM RATINGS
VALUE
UNIT
MIN
MAX
Input voltage
VIN
–0.3
7
V
EN
–0.3
7
BOOT
PH + 8
VSENSE
–0.3
3
COMP
–0.3
3
PWRGD
–0.3
7
SS/TR
–0.3
3
RT
–0.3
6
Output voltage
BOOT-PH
8
V
PH
–0.6
7
PH 10 ns Transient
–2
7
Source current
EN
100
μA
RT
100
Sink current
COMP
100
μA
PWRGD
10
mA
SS/TR
100
μA
Electrostatic discharge (HBM)
2
kV
Electrostatic discharge (CDM)
500
V
Operating Junction temperature, Tj
–40
140
°C
Storage temperature, Tstg
–65
150
°C
THERMAL INFORMATION
TPS54519
THERMAL METRIC(1)(2)
UNITS
RTE (16 PINS)
θJA
Junction-to-ambient thermal resistance (standard board)
49.1
θJA
Junction-to-ambient thermal resistance (custom board)(3)
37.0
ψJT
Junction-to-top characterization parameter
0.7
ψJB
Junction-to-board characterization parameter
21.8
°C/W
θJC(top)
Junction-to-case(top) thermal resistance
50.7
θJC(bot)
Junction-to-case(bottom) thermal resistance
7.5
θJB
Junction-to-board thermal resistance
21.8
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
Power rating at a specific ambient temperature TA should be determined with a junction temperature of 140°C. This is the point where
distortion starts to substantially increase. See power dissipation estimate in the application section of this data sheet for more
information.
(3)
Test boards conditions:
(a) 2 inches x 2 inches, 4 layers, thickness: 0.062 inch
(b) 2 oz. copper traces located on the top of the PCB
(c) 2 oz. copper ground planes on the 2 internal layers and bottom layer
(d) 4 thermal vias (10mil) located under the device package
2
Copyright
2011, Texas Instruments Incorporated
Product Folder Link(s): TPS54519
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