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參數(shù)資料
| 型號(hào)： | TPS2311PW |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | DUAL HOT SWAP POWER CONTROLLER WITH INTERDEPENDENT CIRCUIT BREAKER AND POWER-GOOD REPORTING |
| 中文描述： | 雙熱插拔功率相互依賴的斷路器及功率控制器，高質(zhì)量的報(bào)告 |
| 文件頁數(shù)： | 15/22頁 |
| 文件大?。?/td> | 423K |
| 代理商： | TPS2311PW |
TPS2310, TPS2311
DUAL HOT SWAP POWER CONTROLLER WITH INTERDEPENDENT
CIRCUIT BREAKER AND POWER-GOOD REPORTING
SLVS275B – FEBRUARY 2000 – REVISED APRIL 2000
15
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
typical application diagram
This diagram shows a typical dual hot-swap application. The pullup resistors at PG1, PG2 and Fault should be
relatively large (e.g. 100 k
) to reduce power loss unless they are required to drive a large load.
Vreg
0.1
μ
F
IN1 ISET1
RISET1
ISENSE1
RSENSE1
GATE1 DISCH1 VSENSE1
RVSENSE1_TOP
RVSENSE1_BOTTOM
+
FAULT
PWRGD1
PWRGD2
VO1 or
VO2
FAULT
PWRGD1
PWRGD2
TIMER IN2 ISET2 ISENSE2 GATE2 DISCH2 VSENSE2
ENABLE
DGND
AGND
RISET2
RVSENSE2_TOP
RVSENSE2_BOTTOM
+
VO1
VO2
ENABLE
1
μ
F
～
10
μ
F
RSENSE2
1
μ
F
～
10
μ
F
3 V
～
12 V IN1
3 V
～
5 V IN2
TPS2311
System
Board
Figure 27. Typical Dual Hot-Swap Application
input capacitor
A 0.1-
μ
F ceramic capacitor in parallel with a 1-
μ
F ceramic capacitor should be placed on the input power
terminals near the connector on the hot-plug board to help stabilize the voltage rails on the cards. The
TPS2310/11 does not need to be mounted near the connector or these input capacitors. For applications with
more severe power environments, a 2.2-
μ
F or higher ceramic capacitor is recommended near the input
terminals of the hot-plug board. A bypass capacitor for IN1 and for IN2 should be placed close to the device.
output capacitor
A 0.1-
μ
F ceramic capacitor is recommended per load on the TPS2311; these capacitors should be placed close
to the external FETs and to TPS2310/11. A larger bulk capacitor is also recommended on the load. The value
of the bulk capacitor should be selected based on the power requirements and the transients generated by the
application.
external FET
To deliver power from the input sources to the loads, each channel needs an external N-channel MOSFET. A
few widely used MOSFETs are shown in Table 1. But many other MOSFETs in the market can also be used with
TPS23xx in hot-swap systems.
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| TPS2320ID | 功能描述:熱插拔功率分布 3-13V Dual w/Ind Chl Circuit Breaking RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| TPS2320IDG4 | 功能描述:熱插拔功率分布 3-13V Dual w/Ind Chl Circuit Breaking RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| TPS2320IDR | 功能描述:熱插拔功率分布 3-13V Dual w/Ind Chl Circuit Breaking RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| TPS2320IDRG4 | 功能描述:熱插拔功率分布 3-13V Dual w/Ind Chl Circuit Breaking RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| TPS2320IPW | 功能描述:熱插拔功率分布 3-13V Dual w/Ind Chl Circuit Breaking RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
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