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參數(shù)資料
| 型號(hào)： | TPS2148IDGNR |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | Analog IC |
| 中文描述： | 模擬IC |
| 文件頁數(shù)： | 17/18頁 |
| 文件大?。?/td> | 251K |
| 代理商： | TPS2148IDGNR |
TPS2148
TPS2158
SLVS373
–
AUGUST 2001
17
www.ti.com
DGN (S-PDSO-G8)
PowerPAD
PLASTIC SMALL-OUTLINE PACKAGE
0,69
0,41
0,25
Thermal Pad
(See Note D)
0,15 NOM
Gage Plane
4073271/A 04/98
4,98
4,78
0,25
5
3,05
2,95
8
4
3,05
2,95
1
0,38
0,15
0,05
1,07 MAX
Seating Plane
0,10
0,65
M
0,25
0
°
–
6
°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions include mold flash or protrusions.
D. The package thermal performance may be enhanced by attaching an external heat sink to the thermal pad.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MO-187
PowerPAD is a trademark of Texas Instruments.
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