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參數(shù)資料
| 型號： | TPA0232PWPRG4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻控制 |
| 英文描述： | 2 CHANNEL(S), VOLUME CONTROL CIRCUIT, PDSO24 |
| 封裝： | GREEN, PLASTIC, TSSOP-24 |
| 文件頁數(shù)： | 7/36頁 |
| 文件大?。?/td> | 805K |
| 代理商： | TPA0232PWPRG4 |
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THERMAL INFORMATION
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
Thermal
Pad
TPA0232
SLOS286D – NOVEMBER 1999 – REVISED SEPTEMBER 2004
The thermally enhanced PWP package is based on the 24-pin TSSOP, but includes a thermal pad (see
Figure 30) to provide an effective thermal contact between the IC and the PWB.
Traditionally, surface mount and power have been mutually exclusive terms. A variety of scaled-down
TO-220-type packages have leads formed as gull wings to make them applicable for surface-mount applications.
These packages, however, have only two shortcomings: they do not address the very low profile requirements
(<2 mm) of many of today's advanced systems, and they do not offer a terminal-count high enough to
accommodate increasing integration. On the other hand, traditional low-power surface-mount packages require
power-dissipation derating that severely limits the usable range of many high-performance analog circuits.
The PowerPAD package (thermally enhanced TSSOP) combines fine-pitch, surface-mount technology with
thermal performance comparable to much larger power packages.
The PowerPAD package is designed to optimize the heat transfer to the PWB. Because of the very small size
and limited mass of a TSSOP package, thermal enhancement is achieved by improving the thermal conduction
paths that remove heat from the component. The thermal pad is formed using a patented lead-frame design and
manufacturing technique to provide a direct connection to the heat-generating IC. When this pad is soldered or
otherwise thermally coupled to an external heat dissipator, high power dissipation in the ultrathin, fine-pitch,
surface-mount package can be reliably achieved.
Figure 30. Views of Thermally Enhanced PWP Package
15
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| TPA0233 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:2-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE |
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| TPA0233DGQ | 功能描述:音頻放大器 Mono Class-AB w/Ster Hdphn Drv Summed Inp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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| TPA0233DGQR | 功能描述:音頻放大器 Mono Class-AB w/Ster Hdphn Drv Summed Inp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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