參數(shù)資料
型號(hào)： TPA0211DGNR
元件分類(lèi)： 音頻放大器
英文描述： AUDIO AMPLIFIER|SINGLE|CMOS|TSSOP|8PIN|PLASTIC
中文描述： 音頻放大器|單|的CMOS | TSSOP封裝| 8引腳|塑料
文件頁(yè)數(shù)： 23/42頁(yè)
文件大?。?/td> 806K
代理商： TPA0211DGNR
TPA0202
2-W STEREO AUDIO POWER AMPLIFIER
SLOS205B – FEBRUARY 1998 – REVISED DECEMBER 2000
23
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
THERMAL INFORMATION
The thermally enhanced PWP package is based on the 24-pin TSSOP, but includes a thermal pad (see Figure 58)
to provide an effective thermal contact between the IC and the PWB.
Traditionally, surface-mount and power have been mutually exclusive terms. A variety of scaled-down TO-220-type
packages have leads formed as gull wings to make them applicable for surface-mount applications. These packages,
however, have only two shortcomings: they do not address the very low profile requirements (<2 mm) of many of
today’s advanced systems, and they do not offer a terminal-count high enough to accommodate increasing
integration. On the other hand, traditional low-power surface-mount packages require power-dissipation derating that
severely limits the usable range of many high-performance analog circuits.
The PowerPAD package (thermally enhanced TSSOP) combines fine-pitch surface-mount technology with thermal
performance comparable to much larger power packages.
The PowerPAD package is designed to optimize the heat transfer to the PWB. Because of the very small size and
limited mass of a TSSOP package, thermal enhancement is achieved by improving the thermal conduction paths that
remove heat from the component. The thermal pad is formed using a patented lead-frame design and manufacturing
technique to provide a direct connection to the heat-generating IC. When this pad is soldered or otherwise thermally
coupled to an external heat dissipator, high power dissipation in the ultra-thin, fine-pitch, surface-mount package can
be reliably achieved.
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
Thermal
Pad
Figure 58. Views of Thermally Enhanced PWP Package
相關(guān)PDF資料
PDF描述
TPA0212PWPR AUDIO AMPLIFIER|DUAL|CMOS|TSSOP|24PIN|PLASTIC
TPA0213DGQR Toggle Switch,STRAIGHT,SPDT,(ON)-OFF-(ON),PC TAIL Terminal,TOGGLE BAT,PCB Hole Count:3
TPA0222PWPR AUDIO AMPLIFIER|DUAL|CMOS|TSSOP|24PIN|PLASTIC
TPA0223DGQR Switches, Toggle; Circuitry:SPDT; Switch Operation:On-None-On; Current Rating:2A; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; Switch Function:SPDT
TPA0232PWPR Switches, Toggle; Circuitry:SPDT; Switch Operation:On-None-(On); Contact Current Max:3A; Actuator Style:Bat; Current Rating:3A@120VAC or 29VDC; Leaded Process Compatible:Yes; Operating Temp. Min:-30 C
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TPA0211DGNRG4 功能描述:音頻放大器 Mono Class-AB w/Mono Hdphone Drive RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TPA0211EVM 功能描述:音頻 IC 開(kāi)發(fā)工具 TPA0211 Eval Mod RoHS:否 制造商:Texas Instruments 產(chǎn)品:Evaluation Kits 類(lèi)型:Audio Amplifiers 工具用于評(píng)估:TAS5614L 工作電源電壓:12 V to 38 V
TPA0212 制造商:TI 制造商全稱(chēng):Texas Instruments 功能描述:STEREO 2-W AUDIO POWER AMPLIFIER WITH FOUR SELECTABLE GAIN SETTINGS AND MUX CONTROL
TPA0212_07 制造商:TI 制造商全稱(chēng):Texas Instruments 功能描述:STEREO 2.6-W AUDIO POWER AMPLIFIER WITH FOUR SELECTABLE GAIN SETTINGS AND MUX CONTROL
TPA0212EVM 功能描述:音頻 IC 開(kāi)發(fā)工具 TPA0212 Eval Mod RoHS:否 制造商:Texas Instruments 產(chǎn)品:Evaluation Kits 類(lèi)型:Audio Amplifiers 工具用于評(píng)估:TAS5614L 工作電源電壓:12 V to 38 V
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