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5.2 Recommended Operating Conditions
(1)
TMS320C6421
Fixed-Point Digital Signal Processor
SPRS346C–JANUARY 2007–REVISED NOVEMBER 2007
MIN
NOM
MAX
UNIT
(-6, -5, -5Q, -5S, -4, -4Q,
-4S devices)
1.14
1.2
1.26
V
CV
DD
Supply voltage, Core (CV
DD
)
(2)
(-6 devices)
(3)
1.0
1.05
1.1
V
Supply voltage, I/O, 3.3V (DV
DD33
)
2.97
3.3
3.63
V
DV
DD
Supply voltage, I/O, 1.8V (DV
DDR2
, DDR_VDDDLL, PLL
PWR18
,
MXV
DD(4)
)
1.71
1.8
1.89
V
V
SS
Supply ground (V
SS
, DDR_VSSDLL, MXV
SS(5)
)
0
0
0
V
DDR_VREF
DDR2 reference voltage
(6)
0.49DV
DDR2
0.5DV
DDR2
0.51DV
DDR2
V
DDR_ZP
DDR2 impedance control, connected via 200
resistor to V
SS
V
SS
V
DDR_ZN
DDR2 impedance control, connected via 200
resistor to DV
DDR2
DV
DDR2
V
High-level input voltage, 3.3V (except I2C pins)
2
V
V
IH
High-level input voltage, I2C
0.7DV
DD33
Low-level input voltage, 3.3V (except I2C pins)
0.8
V
V
IL
Low-level input voltage, MXI/ CLKIN
0.35MXV
V
Low-level input voltage, I2C
0
0.3DV
DD33
V
Commercial
0
90
C
T
J
Operating Junction temperature
(7)(8)
Automotive (Q or S
suffix)
–40
125
C
Commercial
0
70
C
T
A
Operating Ambient Temperature
(8)
Automotive (Q or S
suffix)
-40
85
C
(-6 devices, 1.2 V)
600
MHz
(-6 devices, 1.05 V)
(3)
400
MHz
DSP Operating Frequency
(SYSCLK1)
F
SYSCLK1
(-5, -5Q, -5S devices)
500
MHz
(-4, -4Q, -4S devices)
400
MHz
(1)
(2)
The actual voltage
must
be determined at device power-up, and
not
be changed dynamically during run-time.
Future variants of TI SOC devices may operate at voltages ranging from 0.9 V to 1.4 V to provide a range of system power/performance
options. TI highly recommends that users design-in a supply that can handle multiple voltages within this range (i.e., 1.0 V, 1.05 V,
1.1 V, 1.14 V, 1.2, 1.26 V with 3% tolerances) by implementing simple board changes such as reference resistor values or input pin
configuration modifications. Not incorporating a flexible supply may limit the system's ability to easily adapt to future versions of TI SOC
devices.
1.05 V CV
is only supported on -6 devices running at SYSCLK1
≤
400 MHz.
Oscillator 1.8 V power supply (MXV
) can be connected to the same 1.8 V power supply as DV
.
Oscillator ground (MXV
) must be kept separate from other grounds and connected directly to the crystal load capacitor ground.
DDR_VREF is expected to equal 0.5DV
of the transmitting device and to track variations in the DV
.
In the absence of a heat sink or direct thermal attachment on the top of the device, use the following formula to determine the device
junction temperature: T
= T
+ (Power x Psi
). Power and T
can be measured by the user.
Section 7.1
,
Thermal Data for ZWT
and
Section 7.1.1
,
Thermal Data for ZDU
provide the junction-to-package top (PSI
) value based on airflow in the system. In the presence
of a heat sink or direct thermal attachment on the top of the device, additional calculations and considerations
must
be taken into
account. For more detailed information on thermal considerations, measurements, and calculations, see the
Thermal Considerations for
the DM64xx, DM64x, and C6000 Devices
Application Report (literature number
SPRAAL9
).
Applications must meet
both
the Operating Junction Temperature and Operating Ambient Temperature requirements. For more detailed
information on thermal considerations, measurements, and calculations, see the
Thermal Considerations for the DM64xx, DM64x, and
C6000 Devices
Application Report (literature number
SPRAAL9
).
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Device Operating Conditions
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