參數(shù)資料
型號(hào): TMS320C6203CGNZ300
英文描述: DSP|32-BIT|CMOS|BGA|352PIN|PLASTIC
中文描述: 數(shù)字信號(hào)處理器| 32位|的CMOS | BGA封裝| 352PIN |塑料
文件頁數(shù): 72/132頁
文件大?。?/td> 1707K
代理商: TMS320C6203CGNZ300
SPRS145G
JULY 2000
REVISED FEBRUARY 2002
72
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251
1443
device and development support tool nomenclature (continued)
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type
(for example, PAG, PG, PGE, and PZ) and temperature range (for example, A). Figure 19 provides a legend
for reading the complete device name for any TMS320x240xA family member. Refer to the timing section for
specific options that are available on 240xA devices.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system because their
expected end-use failure rate still is undefined. Only qualified production devices are to be used.
PREFIX
TMX =
TMP =
TMS =
TMS 320
LF 2407A
PGE
experimental device
prototype device
qualified device
DEVICE FAMILY
320 =
TMS320
DSP Family
TECHNOLOGY
LC =
Low-voltage CMOS (3.3 V)
LF =
Flash EEPROM (3.3 V)
PACKAGE TYPE
PG =
64-pin QFP
PAG=
64-pin TQFP
PGE=
144-pin plastic LQFP
PZ
=
100-pin plastic LQFP
VF
=
32-pin plastic LQFP
DEVICE
240xA DSP
2407A
2406A
2404A
2403A
2402A
2401A
QFP
LQFP =
TQFP =
The package dimensions of the 2407A and 2406A devices correspond to the LQFP package. These devices were stated to be
in TQFP packaging in the TMX data sheets. The package dimensions have
not
changed; only the package designation has
changed.
=
Quad Flatpack
Low-Profile Quad Flatpack
Thin Quad Flatpack
TEMPERATURE RANGE
A
=
40
°
C to 85
°
C
S
=
40
°
C to 125
°
C
A
Figure 19. TMS320x240xA Device Nomenclature
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