參數(shù)資料
型號(hào)： TMP93CS20F
廠商： Toshiba Corporation
元件分類： 微控制器
英文描述： Quality And Reliability Assurance / Handling Precautions
中文描述： 質(zhì)量與可靠性保證/操作注意事項(xiàng)
文件頁(yè)數(shù)： 44/48頁(yè)
文件大?。?/td> 390K
代理商： TMP93CS20F
Quality and Reliability Assurance / Handling Precautions
030901
QUA-44
2002-02-20
4.5.4 Flux Cleaning and Ultrasonic Cleaning
(1)
When cleaning circuit boards to remove flux, make sure that no residual
reactive ions such as Na or Cl remain. Note that organic solvents react
with water to generate hydrogen chloride and other corrosive gases which
can degrade device performance.
Washing devices with water will not cause any problems. However, make
sure that no reactive ions such as sodium and chlorine are left as residues.
Also, be sure to dry devices sufficiently after washing.
Do not rub device markings with a brush or with your hand during
cleaning or while the devices are still wet from the cleaning agent. Doing
so can rub off the markings.
The dip cleaning, shower cleaning and steam cleaning processes all
involve the chemical action of a solvent. Use only recommended solvents
for these cleaning methods. When immersing devices in a solvent or
steam bath, make sure that the temperature of the liquid is 50°C or below,
and that the circuit board is removed from the bath within one minute.
Ultrasonic cleaning should not be used with hermetically-sealed ceramic
packages such as a leadless chip carrier (LCC), pin grid array (PGA) or
charge-coupled device (CCD), because the bonding wires can become
disconnected due to resonance during the cleaning process. Even if a
device package allows ultrasonic cleaning, limit the duration of ultrasonic
cleaning to as short a time as possible, since long hours of ultrasonic
cleaning degrade the adhesion between the mold resin and the frame
material. The following ultrasonic cleaning conditions are recommended:
Frequency: 27 kHz to 29 kHz
Ultrasonic output power: 300 W or less (0.25 W/cm
2
or less)
Cleaning time: 30 seconds or less
Suspend the circuit board in the solvent bath during ultrasonic cleaning
in such a way that the ultrasonic vibrator does not come into direct
contact with the circuit board or the device.
(2)
(3)
(4)
(5)
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相關(guān)代理商/技術(shù)參數(shù)
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TMP93CS32F 制造商:Toshiba America Electronic Components 功能描述:TLCS-900/L M/ROM, 64K ROM, 2K RAM - Tape and Reel
TMP93CS32FG 功能描述:16位微控制器 - MCU TLCS-900/L M/Rom 64K ROM 2K RAM RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
TMP93CS36 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:CMOS 16-BIT MICROCONTROLLER
TMP93CS40 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microcontroller
TMP93CS40DF 制造商:Toshiba America Electronic Components 功能描述:MCU 16BIT TLCS-900 CISC 64KB ROM 3.3V/5V 100LQFP - Tape and Reel
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