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參數(shù)資料
| 型號： | TMP93CS20F |
| 廠商： | Toshiba Corporation |
| 元件分類： | 微控制器 |
| 英文描述： | Quality And Reliability Assurance / Handling Precautions |
| 中文描述： | 質(zhì)量與可靠性保證/操作注意事項 |
| 文件頁數(shù)： | 22/48頁 |
| 文件大小： | 390K |
| 代理商： | TMP93CS20F |
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Quality and Reliability Assurance / Handling Precautions
030901
QUA-22
2002-02-20
(7) 68000 Series
Table 2.9 Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method
Products
Name
Package no.
Air reflow
Infrared reflow
TMP68301AF-xx
TMP68301AKF-xx
TMP68303DF-xx
TMP68305F-xx
TMP68301AFR-xx
TMP68301AKFR-xx
TMP68HC003F-xx
TMP68204F-xx
Note 1:
P-QFP100-2222-0.80A
P-QFP100-2222-0.80A
P-QFP100-2222-0.80A
P-QFP100-2222-0.80A
P-QFP100-1420-0.65A
P-QFP100-1420-0.65A
P-QFP80-1420-0.80B
P-QFP160-2828-0.65A
As of February, 1998
A(168h)
A(168h)
G
A(168h)
A(168h)
A(168h)
A(168h)
G
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
Note 2:
Ensure that the conditions for top/bottom heating using the
long/medium infrared reflow method are strictly adhered to, even when
this method is used in combination with the air reflow method.
Symbols A (168h), B (72h), C (48h), D (24h), E(12h),
G
and
indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
Note 3:
(8) Z80 Series
Table 2.10 Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method
Products
Name
Package no.
Air reflow
Infrared reflow
TMPZ84C011BF
TMPZ84C015BF
TMPZ84C013AT
TMPZ84C112AF
TMPZ84C711AF
TMPZ84C810AF
Note 1:
P-QFP100-1420-0.65A
P-QFP100-1420-0.65A
P-QFJ84-S115-1.27
P-QFP64-1420-1.00A
P-QFP144-2626-0.65B
P-QFP100-1420-0.65A
As of September, 1994
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
Note 2:
Ensure that the conditions for top/bottom heating using the
long/medium infrared reflow method are strictly adhered to, even when
this method is used in combination with the air reflow method.
Symbols A (168h), B (72h), C (48h), D (24h), E(12h),
G
and
indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
Note 3:
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TMP93CS32F | 制造商:Toshiba America Electronic Components 功能描述:TLCS-900/L M/ROM, 64K ROM, 2K RAM - Tape and Reel |
| TMP93CS32FG | 功能描述:16位微控制器 - MCU TLCS-900/L M/Rom 64K ROM 2K RAM RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時鐘頻率:24 MHz 程序存儲器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT |
| TMP93CS36 | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:CMOS 16-BIT MICROCONTROLLER |
| TMP93CS40 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microcontroller |
| TMP93CS40DF | 制造商:Toshiba America Electronic Components 功能描述:MCU 16BIT TLCS-900 CISC 64KB ROM 3.3V/5V 100LQFP - Tape and Reel |
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