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參數(shù)資料
| 型號(hào)： | TMP91CW18AF |
| 廠商： | Toshiba Corporation |
| 英文描述： | Quality And Reliability Assurance / Handling Precautions |
| 中文描述： | 質(zhì)量與可靠性保證/操作注意事項(xiàng) |
| 文件頁(yè)數(shù)： | 5/48頁(yè) |
| 文件大?。?/td> | 390K |
| 代理商： | TMP91CW18AF |
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Quality and Reliability Assurance / Handling Precautions
030901
QUA-5
2002-02-20
2 Handling Precautions for Microcontrollers
2.1
Mounting Precautions
Plastics have basically porous feature. When a chip (especially an SMD which has a thin
plastic surface) is heated in a state of moisturized and is soldered by the reflow soldering
method, moisture is vaporized as the temperature rises to cause a package expanded. Or a
borderd surface between a lead frame and a plastic material is peeled off to cause a crack.
These bring serious troubles on reliability.
In order to prevent hygroscopity or enable high heat treatment after absorbing moisture,
Toshiba uses a dampproof packing and/or a heat proof tray.
(1)
Recommended Methods of Soldering for Flat Packages
Table 2.1 lists the recommended method of soldering flat packages. If you have
any question or request, please refer to “IC PACKAGE MANUAL” or contact
your local offices.
For overall heating method, recommended mounting methods and
conditions after opening the pack differ depending on products to be
used. See Table 2.2 and 2.3 for the details.
For locally heating a lead part, soldering iron method is
recommended. For other localized heating methods, refer to “IC
PACKAGE MANUAL” or contact your Toshiba local offices.
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