- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄365844 > TMP91CW18AF (Toshiba Corporation) Quality And Reliability Assurance / Handling Precautions PDF資料下載
參數(shù)資料
| 型號： | TMP91CW18AF |
| 廠商： | Toshiba Corporation |
| 英文描述： | Quality And Reliability Assurance / Handling Precautions |
| 中文描述： | 質(zhì)量與可靠性保證/操作注意事項 |
| 文件頁數(shù)： | 31/48頁 |
| 文件大?。?/td> | 390K |
| 代理商： | TMP91CW18AF |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁當(dāng)前第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁
Quality and Reliability Assurance / Handling Precautions
030901
QUA-31
2002-02-20
4.1.2 Vibration, Impact and Stress
Handle devices and packaging materials with care.
To avoid damage to devices, do not toss or drop
packages. Ensure that devices are not subjected to
mechanical vibration or shock during
transportation. Ceramic package devices and
devices in canister-type packages which have
empty space inside them are subject to damage
from vibration and shock because the bonding wires are secured only at their
ends.
Plastic molded devices, on the other hand, have a relatively high level of
resistance to vibration and mechanical shock because their bonding wires are
enveloped and fixed in resin. However, when any device or package type is
installed in target equipment, it is to some extent susceptible to wiring
disconnections and other damage from vibration, shock and stressed solder
junctions. Therefore when devices are incorporated into the design of
equipment which will be subject to vibration, the structural design of the
equipment must be thought out carefully.
If a device is subjected to especially strong vibration, mechanical shock or
stress, the package or the chip itself may crack. In products such as CCDs
which incorporate window glass, this could cause surface flaws in the glass or
cause the connection between the glass and the ceramic to separate.
Furthermore, it is known that stress applied to a semiconductor device
through the package changes the resistance characteristics of the chip because
of piezoelectric effects. In analog circuit design attention must be paid to the
problem of package stress as well as to the dangers of vibration and shock as
described above.
Vibration
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TMP91CY22F | Quality And Reliability Assurance / Handling Precautions |
| TMP91FY12AF | Quality And Reliability Assurance / Handling Precautions |
| TMP91FY22F | Quality And Reliability Assurance / Handling Precautions |
| TMP91PW10F | Quality And Reliability Assurance / Handling Precautions |
| TMP91PW11F | Quality And Reliability Assurance / Handling Precautions |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TMP91CW28 | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Original CMOS 16-Bit Microcontroller |
| TMP91CW60DFG | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:16 Bit Microcontroller |
| TMP91CW60FG | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:16 Bit Microcontroller |
| TMP91CY22F | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Quality And Reliability Assurance / Handling Precautions |
| TMP91CY22IFG | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Original CMOS 16-Bit Microcontroller |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。