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參數(shù)資料
| 型號： | TMP91CW12AF |
| 廠商： | Toshiba Corporation |
| 元件分類： | 微控制器 |
| 英文描述： | Quality And Reliability Assurance / Handling Precautions |
| 中文描述： | 質(zhì)量與可靠性保證/操作注意事項 |
| 文件頁數(shù)： | 6/48頁 |
| 文件大?。?/td> | 390K |
| 代理商： | TMP91CW12AF |
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Quality and Reliability Assurance / Handling Precautions
030901
QUA-6
2002-02-20
Table 2.1 Recommended soldering methods and precautions when mounting
Soldering method
Localized heating
method
Mounting method
Soldering iron method
Mounting precaution
The recommended soldering conditions are as follows:
(1)
Standard:
EIAJ ED-4701A-133
Environment test, soldering heat-
resistance test (SMD)
(2)
Soldering method: Soldering (lead only)
(3)
Soldering condition: (a)at 350
°
C for up to 3 seconds.
(b)at 260
°
C for up to 10
seconds.
Wave soldering method
(Solder flow)
(1)
Apply preheating for 60 to 120 seconds at a
temperature of 150°C.
(2)
For lead insertion-type packages, complete
solder flow within 10 seconds with the
temperature at the stopper (or, if there is no
stopper, at a location more than 1.5 mm from the
body) which does not exceed 260°C.
(3)
For
surface-mount
soldering within 5 seconds at a temperature of
250°C or less in order to prevent thermal stress
in the device.
For details, contact your local Toshiba dealer.
Because thermal stress is severe, as with solder dipping,
the infrared reflow method is not recommended for some
products. For details, contact your local Toshiba dealer.
The recommended conditions for SMD reflow are as
follows:
(1)
Standard:
EIAJ ED-4701 A-133
Environment test
(2)
Soldering method: (a) Hot air reflow
(with optional far or middle
infrared reflow process)
(b) Far or middle infrared reflow
(3)
Pre-heating: 140 to 160
°
C, for 60 to 120 seconds.
(4)
Reflow:(a) 240
°
C max
(b) At more than 210
°
C, for 30 to 50 seconds.
(5)
Number of reflows: Maximum of two times within the
allowable period of use
The specified soldering temperatures are based on
the temperature of the package surface.
For a sample recommended temperature profile,
refer to Figure 2.1.
packages,
complete
Short infrared reflow
method
Overall heating method
Far or middle infrared
Hot air reflow
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