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參數(shù)資料
| 型號： | TMP91CW12AF |
| 廠商： | Toshiba Corporation |
| 元件分類： | 微控制器 |
| 英文描述： | Quality And Reliability Assurance / Handling Precautions |
| 中文描述： | 質(zhì)量與可靠性保證/操作注意事項(xiàng) |
| 文件頁數(shù)： | 38/48頁 |
| 文件大?。?/td> | 390K |
| 代理商： | TMP91CW12AF |
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Quality and Reliability Assurance / Handling Precautions
030901
QUA-38
2002-02-20
4.3.9 Interfacing
When connecting inputs and outputs between devices, make sure input
voltage (V
IL
/V
IH
) and output voltage (V
OL
/V
OH
) levels are matched. Otherwise,
the devices may malfunction. When connecting devices operating at different
supply voltages, such as in a dual-power-supply system, be aware that
erroneous power-on and power-off sequences can result in device breakdown.
For details of how to interface particular devices, consult the relevant
technical datasheets and databooks. If you have any questions or doubts about
interfacing, contact your nearest Toshiba office or distributor.
4.3.10 Decoupling
Spike currents generated during switching can cause Vcc (Vdd) and GND
(Vss) voltage levels to fluctuate, causing ringing in the output waveform or a
delay in response speed. (The power supply and GND wiring impedance is
normally 50
to 100
.) For this reason, the impedance of power supply lines
with respect to high frequencies must be kept low. This can be accomplished
by using thick and short wiring for the Vcc (Vdd) and GND (Vss) lines and by
installing decoupling capacitors (of approximately 0.01 to 1
μ
F capacitance) as
high-frequency filters between Vcc (Vdd) and GND (Vss) at strategic locations
on the printed circuit board.
For low-frequency filtering, it is a good idea to install a 10- to 100-
μ
F capacitor
on the printed circuit board (one capacitor will suffice). If the capacitance is
excessively large, however, (e.g. several thousand
μ
F) latch-up can be a
problem. Be sure to choose an appropriate capacitance value.
An important point about wiring is that, in the case of high-speed logic ICs,
noise is caused mainly by reflection and crosstalk, or by the power supply
impedance. Reflections cause increased signal delay, ringing, overshoot and
undershoot, thereby reducing the device’s safety margins with respect to noise.
To prevent reflections, reduce the wiring length by increasing the device
mounting density so as to lower the inductance (L) and capacitance (C) in the
wiring. Extreme care must be taken, however, when taking this corrective
measure, since it tends to cause crosstalk between the wires. In practice, there
must be a trade-off between these two factors.
4.3.11 External Noise
Printed circuit boards with long I/O or signal
pattern lines are vulnerable to induced noise or
surges from outside sources. Consequently,
malfunctions or breakdowns can result from
overcurrent or overvoltage, depending on the
types of device used. To protect against noise,
lower the impedance of the pattern line or insert
a noise-canceling circuit. Protective measures
must also be taken against surges.
For details of the appropriate protective measures for a particular device,
consult the relevant databook.
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