參數(shù)資料
型號(hào)： TMP320C40KGD
廠商： Texas Instruments, Inc.
元件分類： 數(shù)字信號(hào)處理
英文描述： Floating-Point Digital Signal Processor Known Good Die(具高性能CPU和DMA控制器，6個(gè)通訊口的DSP)
中文描述： 浮點(diǎn)數(shù)字信號(hào)處理器已知良品裸片（具高性能的CPU和DMA的控制器，6個(gè)通訊口的數(shù)字信號(hào)處理器）
文件頁(yè)數(shù)： 4/10頁(yè)
文件大?。?/td> 184K
代理商： TMP320C40KGD
TMP320C40KGD, SMJ320C40KGD
FLOATING-POINT DIGITAL SIGNAL PROCESSORS
KNOWN GOOD DIE
SPRS036 – NOVEMBER 1995
4
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251–1443
JEDEC STANDARD
Die thickness is approximately 15 mils.
Backside surface finish is silicon.
Maximum allowable die junction operating temperature is 175
°
C.
Glassivation material is compressive nitride.
Bond pad metal is composed of copper-doped aluminum.
Percent defective allowed for burned-in die is 5.
Life test data is available.
Configuration control notification.
Group A attribute summary is available (SMJ only).
Suggested die-attach material is QMI 2569F.
Suggested bond wire size is 1.0 to 1.25 mil.
Suggested bonding method is gold-ball bonding.
ESD rating is Class II.
Maximum allowable peak process temperature for die-attach is 440
°
C.
Saw curve is dependent on blade size used.
Moisture-resistance data on die in plastic and TAB packages is available.
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