參數(shù)資料
型號: TMP320C40KGD
廠商: Texas Instruments, Inc.
元件分類: 數(shù)字信號處理
英文描述: Floating-Point Digital Signal Processor Known Good Die(具高性能CPU和DMA控制器,6個通訊口的DSP)
中文描述: 浮點數(shù)字信號處理器已知良品裸片(具高性能的CPU和DMA的控制器,6個通訊口的數(shù)字信號處理器)
文件頁數(shù): 3/10頁
文件大?。?/td> 184K
代理商: TMP320C40KGD
TMP320C40KGD, SMJ320C40KGD
FLOATING-POINT DIGITAL SIGNAL PROCESSORS
KNOWN GOOD DIE
SPRS036 – NOVEMBER 1995
3
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251–1443
description (continued)
The hardware development and verification tools include:
Parallel processor in-circuit emulator and high-level language debugger: XDS510
Parallel processor development system with four TMS320C40s; local and global memory; and
communication-port connections
known good die technology
Known good die (KGD) options are offered for use in multichip modules and chip-on-board (COB) applications.
The current verification technology used to support KGD requirements for the TMP/SMJ320C40KGD is the
removable tab (R-Tab).
The availability of selected DSP products in a tape-automated bond (TAB) configuration has made possible the
use of a removable TAB technique. The TAB leadframe is attached to a gold-bumped die using nonoptimal
bonding parameters. This technique allows easy removal of the tape after all needed 100% screens and
parametric tests. The tape is removed from the tested part and the die is shipped in a conventional die container.
The gold bumps remain on the bond pads which allow for subsequent attachment of gold-ball bonds.
electrical specifications
For military electrical and timing specifications please refer to the SMJ320C40 Digital Signal Processordata
sheet, literature number SGUS017. For commercial electrical and timing specifications please refer to the
TMS320C4x User’s Guide literature number SPRU063A.
SMJ
320
C
40
M
KGD
40
PREFIX
SMJ =
TMP =
MIL-STD-883D
Commercial Level
DEVICE FAMILY
320 =
DSP Family
TECHNOLOGY
C =
CMOS
DEVICE
40 =
Floating-Point DSP
SPEED RANGE
40 =
50 =
40 MHz
50 MHz
PACKAGE TYPE
KGD = Known Good Die
TEMPERATURE RANGE
M = – 55
°
C to125
°
C
L =
0
°
C to 70
°
C
A
DIE REVISION
A
=
B
=
Revision 2.3
Revision 3.3
Figure 1. TMP/SMJ320C40KGD Device Nomenclature
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