參數(shù)資料
型號(hào): TLPxxG
廠商: 意法半導(dǎo)體
英文描述: TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE
中文描述: 三極的電信線過(guò)電壓保護(hù)
文件頁(yè)數(shù): 13/14頁(yè)
文件大?。?/td> 157K
代理商: TLPXXG
SUBSTRATESAND MOUNTINGINFORMATION
The use of epoxyFR4 boardsis quite common for
surface mounting techniques,however, their poor
thermal conductioncompromisesthe
outstandingthermalperformanceof thePowerSO-
10. Some methodsto overcome thislimitation are
discussedbelow.
One possibility to improve the thermal conduction
is the use of large heat spreaderareas at thecop-
per layerofthePC board.Thisleadsto areduction
of thermal resistance to 35
°
C for 6 cm
2
of the
board heatsink(seefig.2).
Use of copper-filledthroughholes on conventional
FR4 techniqueswill increase the metallization and
otherwise
decrease thermal resistance accordingly. Using
a configurationwith 16holesunderthe spreaderof
the packagewith a pitchof 1.8 mm anda diameter
of 0.7 mm, the thermal resistance (junction -
heatsink) can be reduced to 12
°
C/W (see fig. 3).
Besidethe thermaladvantage,thissolutionallows
multi-layer boards to be used. However, a draw-
back of this traditional material prevents its use in
veryhighpower,highcurrentcircuits.Forinstance,
it is not advisable to surface mount devices with
currents greater than 10 A on FR4 boards. A
PowerMosfetor Schottkydiodeinasurfacemount
power package can handle up to around 50 A if
bettersubstratesare used.
Fig.2 :
Mountingon epoxyFR4head dissipationbyextendingthe area of thecopper layer
Fig. 3 :
Mountingon epoxyFR4 byusing copper-filledthroughholesfor heattransfer
FR4 board
Copper foil
FR4board
Copperfoil
heattransfer
heatsink
TLPxxM/G/G-1
13/14
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