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參數(shù)資料
| 型號： | TLPxxG |
| 廠商： | 意法半導體 |
| 英文描述： | TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE |
| 中文描述： | 三極的電信線過電壓保護 |
| 文件頁數(shù)： | 12/14頁 |
| 文件大小： | 157K |
| 代理商： | TLPXXG |
SOLDERINGRECOMMENDATION
The soldering process causes considerable ther-
mal stress to a semiconductor component. This
has to be minimized to assure a reliable and ex-
tended lifetime of the device. The PowerSO-10
package can be exposedto a maximum tempera-
ture of 260
°
C for 10 seconds. However a proper
soldering of the package could be done at 215
°
C
for 3 seconds. Any solder temperature profile
shouldbe withinthese limits. Asreflowtechniques
are most common in surface mounting, typical
heating profiles are given in Figure 1,either for
mounting on FR4 or on metal-backedboards. For
each particular board, the appropriateheat profile
has to be adjusted experimentally. The present
proposalisjusta startingpoint.In anycase,thefol-
lowingprecautionshaveto be considered:
- alwayspreheatthe device
- peaktemperatureshould be at least30
°
C
higherthanthe meltingpointof thesolder
alloychosen
- thermalcapacityof the basesubstrate
Voids pose a difficult reliability problem for large
surface mount devices. Such voids under the
package result in poor thermal contact and the
high thermal resistance leads to component fail-
ures.The PowerSO-10is designedfromscratchto
be solelya surfacemountpackage,hencesymme-
try inthe x- and y-axisgivesthe packageexcellent
weight balance.Moreover, the PowerSO-10offers
the unique possibility to control easily the flatness
and quality of the soldering process. Both the top
and the bottomsolderededgesof thepackageare
accessible for visual inspection (soldering menis-
cus).
Coplanarity between the substrate and the pack-
age can beeasilyverified. The qualityof the solder
joints is very important for two reasons : (I) poor
quality solder joints result directlyin poor reliability
and (II) solder thickness affects the thermal resis-
tance significantly. Thus a tight control of this pa-
rameter results in thermally efficient and reliable
solderjoints.
Fig. 1 :
Typicalreflow solderingheatprofile
Time (s)
Temperature ( C)
0
40
80
120
160
200
240
280
320
360
0
50
100
150
200
250
o
215 C
Soldering
Preheating
Cooling
245 C
Epoxy FR4
board
Metal-backed
board
TLPxxM/G/G-1
12/14
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| TLPXXG-1 | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE |
| TLPXXM | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE |
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