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參數(shù)資料
| 型號： | TLC27X |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | FAMILY OF 500-UA/CH 3-MHZ RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS |
| 中文描述： | 3系列的500-UA/CH MHz的軌到軌輸出運(yùn)算放大器 |
| 文件頁數(shù)： | 15/22頁 |
| 文件大小： | 514K |
| 代理商： | TLC27X |
μ
SGLS275 OCTOBER 2004
15
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
general power dissipation considerations
For a given
θ
JA
, the maximum power dissipation is shown in Figure 29 and is calculated by the following formula:
PD
TMAX–TA
JA
Where:
P
D
T
MAX
= Absolute maximum junction temperature (150
°
C)
T
A
= Free-ambient air temperature (
°
C)
θ
JA
=
θ
JC
+
θ
CA
θ
JC
= Thermal coefficient from junction to case
θ
CA
= Thermal coefficient from case to ambient air (
°
C/W)
= Maximum power dissipation of TLV27x IC (watts)
1
0.75
0.5
0
5540 25 10 5
M
1.25
1.5
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
1.75
20 35
50
0.25
TA Free-Air Temperature
°
C
2
65 80 95 110 125
MSOP Package
Low-K Test PCB
θ
JA = 260
°
C/W
TJ = 150
°
C
PDIP Package
Low-K Test PCB
θ
JA = 104
°
C/W
SOIC Package
Low-K Test PCB
θ
JA = 176
°
C/W
SOT-23 Package
Low-K Test PCB
θ
JA = 324
°
C/W
NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.
Figure 29. Maximum Power Dissipation vs Free-Air Temperature
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