參數(shù)資料
型號(hào)： TLC075CPWPRG4
廠商： Texas Instruments, Inc.
英文描述： FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS
中文描述： 家庭具有寬帶高輸出驅(qū)動(dòng)單電源運(yùn)算放大器
文件頁(yè)數(shù)： 22/48頁(yè)
文件大?。?/td> 1839K
代理商： TLC075CPWPRG4
SLOS219E JUNE 1999 REVISED SEPTEMBER 2006
22
WWW.TI.COM
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
APPLICATION INFORMATION
general PowerPAD design considerations
The TLC07x is available in a thermally-enhanced PowerPAD family of packages. These packages are
constructed using a downset leadframe upon which the die is mounted [see Figure 52(a) and Figure 52(b)]. This
arrangement results in the lead frame being exposed as a thermal pad on the underside of the package [see
Figure 52(c)]. Because this thermal pad has direct thermal contact with the die, excellent thermal performance
can be achieved by providing a good thermal path away from the thermal pad.
The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.
During the surface-mount solder operation (when the leads are being soldered), the thermal pad must be
soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,
heat can be conducted away from the package into either a ground plane or other heat dissipating device.
Soldering the PowerPAD to the PCB is always required, even with applications that have low-power dissipation.
This provides the necessary thermal and mechanical connection between the lead frame die pad and the PCB.
The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of
surface mount with mechanical methods of heatsinking.
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
Thermal
Pad
NOTE A: The thermal pad is electrically isolated from all terminals in the package.
Figure 52. Views of Thermally-Enhanced DGN Package
相關(guān)PDF資料
PDF描述
TLC075IPWPRG4 FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS
TLC0820A(中文) Advanced LinCMOS 8-Bit Analog-To-Digital Converters(8位高速A/D轉(zhuǎn)換器(帶改進(jìn)的flash))
TLC0831(中文) 8-Bit Successive-Approximation Analog-To-Digital Converters(單輸入通道，串行I/O接口8位A/D轉(zhuǎn)換器)
TLC0832(中文) 8-Bit Successive-Approximation Analog-To-Digital Converters(多重雙輸入通道，串行I/O接口8位A/D轉(zhuǎn)換器)
TLC0834(中文) 8-Bit Successive-Approximation Analog-To-Digital Converters(4通道，串行I/O接口8位A/D轉(zhuǎn)換器)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TLC075ID 制造商:Rochester Electronics LLC 功能描述:- Bulk
TLC075IDG4 制造商:TI 制造商全稱:Texas Instruments 功能描述:FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS
TLC075IDR 功能描述:運(yùn)算放大器 - 運(yùn)放 Quad Wide-Bandwidth Hi-Output-Drive RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLC075IDRG4 功能描述:運(yùn)算放大器 - 運(yùn)放 Quad Wide Bandwidth Op Amp w/Shutdown RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLC075IN 功能描述:運(yùn)算放大器 - 運(yùn)放 Quad R/R RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
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