參數(shù)資料
型號(hào): TISP61089BD-S
廠商: Electronic Theatre Controls, Inc.
英文描述: TISP61089B High Voltage Ringing SLIC Protector
中文描述: TISP61089B高壓振鈴用戶接口保護(hù)
文件頁(yè)數(shù): 21/22頁(yè)
文件大?。?/td> 411K
代理商: TISP61089BD-S
OCTOBER 2000 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089B High Voltage Ringing SLIC Protector
D008 Plastic Small-Outline Package
This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will
withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high
humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
NOTES: A. Leads are within 0.25 (0.010) radius of true position at maximum material condition.
B. Body dimensions do not include mold flash or protrusion.
C. Mold flash or protrusion shall not exceed 0.15 (0.006).
D. Lead tips to be planar within
±
0.051 (0.002).
MDXXAAE
5.80 - 6.20
(0.228 - 0.244)
4.80 - 5.00
(0.189 - 0.197)
D008
8
7
6
5
4
3
2
1
3.81 - 4.00
(0.150 - 0.157)
7
°
NOM
3 Places
7
°
NOM
4 Places
4
°
±
4
°
0.28 - 0.79
(0.011 - 0.031)
0.102 - 0.203
(0.004 - 0.008)
8-pin Small Outline Microelectronic Standard
Package MS-012, JEDEC Publication 95
x 45
°
NOM
0.190 - 0.229
(0.0075 - 0.0090)
INDEX
Pin Spacing
1.27
(0.050)
(see Note A)
6 Places
1.35 - 1.75
(0.053 - 0.069)
0.36 - 0.51
(0.014 - 0.020)
8 Places
0.51 - 1.12
(0.020 - 0.044)
0.25 - 0.50
(0.010 - 0.020)
4.60 - 5.21
(0.181 - 0.205)
DIMENSIONS ARE:MI(INCHES)
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