參數(shù)資料
型號(hào)： THS6022EVM
廠商： Texas Instruments, Inc.
英文描述： 250-mA DUAL DIFFERENTIAL LINE DRIVER
中文描述： 250毫安雙差分線路驅(qū)動(dòng)器
文件頁(yè)數(shù)： 4/38頁(yè)
文件大?。?/td> 646K
代理商： THS6022EVM
THS6022
250-mA DUAL DIFFERENTIAL LINE DRIVER
SLOS225C – SEPTEMBER 1998 – REVISED JANUARY 2000
4
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
functional block diagram
_
+
Driver 1
Driver 2
_
+
3
4
5
11
10
2
1
12
13
14
VCC+
VCC+
VCC–
VCC–
1OUT
2 OUT
1 IN+
1 IN–
2 IN+
2 IN–
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage, V
CC+
to V
CC–
Input voltage, V
I
Output current, I
O
(see Note 1)
Differential input voltage, V
ID
Continuous total power dissipation at (or below) T
A
= 25
°
C (see Note 1)
Operating free air temperature, T
A
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, T
stg
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature, 1,6 mm (1/16 inch) from case for 10 seconds
33 V
±
V
CC
400 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6 V
3.3 W
. . . . . . . . . . . . . . . . . . . . . . . . . .
–40
°
C to 85
°
C
–65
°
C to 125
°
C
300
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The THS6022 incorporates a PowerPad on the underside of the chip. This acts as a heatsink and must be connected to a thermal
dissipation plane for proper power dissipation. Failure to do so can result in exceeding the maximum junction temperature, which could
permanently damage the device. See the Thermal Informationsection of this document for more information about PowerPad
technology.
recommended operating conditions
MIN
±
4.5
NOM
MAX
±
16
UNIT
Supply voltage VCC and VCC
Supply voltage, VCC+ and VCC–
Split supply
V
Single supply
C Suffix
9
0
32
70
Operating free-air temperature TA
O erating free-air tem erature, TA
°
C
I Suffix
–40
85
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