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參數(shù)資料
| 型號： | THS6012CGQE |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | 500-mA DUAL DIFFERENTIAL LINE DRIVER |
| 中文描述： | 500毫安雙差分線路驅(qū)動器 |
| 文件頁數(shù)： | 21/35頁 |
| 文件大?。?/td> | 604K |
| 代理商： | THS6012CGQE |
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THS6012
500-mA DUAL DIFFERENTIAL LINE DRIVER
SLOS226C– SEPTEMBER 1998 – REVISED FEBRUARY 2000
21
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
thermal information
The THS6012 is packaged in a thermally-enhanced DWP package, which is a member of the PowerPAD family
of packages. This package is constructed using a downset leadframe upon which the die is mounted
[see Figure 39(a) and Figure 39(b)]. This arrangement results in the lead frame being exposed as a thermal pad
on the underside of the package [see Figure 39(c)]. Because this thermal pad has direct thermal contact with
the die, excellent thermal performance can be achieved by providing a good thermal path away from the thermal
pad.
The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.
During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be
soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,
heat can be conducted away from the package into either a ground plane or other heat dissipating device. This
is discussed in more detail in the PCB design considerationssection of this document.
The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of
surface mount with the, heretofore, awkward mechanical methods of heatsinking.
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
Thermal
Pad
NOTE A: The thermal pad is electrically isolated from all terminals in the package.
Figure 39. Views of Thermally Enhanced DWP Package
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| THS6022GQE | 250-mA DUAL DIFFERENTIAL LINE DRIVER |
| THS6022EVM | 250-mA DUAL DIFFERENTIAL LINE DRIVER |
| THS6022IGQE | SLIM MOX, SM-102 , 47 MEG, 5%, ROHS |
| THS6022PWP | 250-mA DUAL DIFFERENTIAL LINE DRIVER |
| THS6022CGQE | 250-mA DUAL DIFFERENTIAL LINE DRIVER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| THS6012DWP | 制造商:TI 制造商全稱:Texas Instruments 功能描述:500-mA DUAL DIFFERENTIAL LINE DRIVER |
| THS6012EVM | 功能描述:其他開發(fā)工具 THS6012 Hi-Spd Amp Eval Mods RoHS:否 制造商:Parallax 產(chǎn)品:ELEV-8 Hex Upgrade Kits 類型:Robotics 工具用于評估:ELEV-8 Quadcopter 工作電源電壓: |
| THS6012GQE | 制造商:TI 制造商全稱:Texas Instruments 功能描述:500-mA DUAL DIFFERENTIAL LINE DRIVER |
| THS6012IDWP | 功能描述:緩沖器和線路驅(qū)動器 500-mA Dual Diff Line Driver RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| THS6012IDWPG4 | 功能描述:緩沖器和線路驅(qū)動器 500mA Dual Diff Line Driver RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
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