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參數(shù)資料
| 型號： | THMC10SSOPDBQ |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | REMOTE/LOCAL TEMPERATURE MONITOR WITH SMBus INTERFACE |
| 中文描述： | 遠(yuǎn)端/本地溫度監(jiān)測SMBus接口 |
| 文件頁數(shù)： | 3/20頁 |
| 文件大?。?/td> | 269K |
| 代理商： | THMC10SSOPDBQ |
THMC10
REMOTE/LOCAL TEMPERATURE MONITOR
WITH SMBus INTERFACE
SLIS089 – DECEMBER 1999
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME
ADD0
NO.
10
I
SMBus address select terminal 0 (Note: Excess capacitance on this terminal may cause SMBus address
recognition problems.)
ADD1
6
I
SMBus address select terminal 1 (Note: Excess capacitance on this terminal may cause SMBus address
recognition problems.)
ALERT
11
O
Active low temperature interrupt signal
DXN
4
I/O
Current sink for external diode connected transistor and A/D negative input (Do not leave floating if no external
diode is used – should be tied to GND.)
DXP
3
I/O
Current source for external diode connected transistor and A/D positive input
GND
7, 8
I
IC ground
N/C
1, 5, 9,
13, 16
N/C
No connection
SCLK
14
I
SMBus serial clock input terminal – clock signal for SMBus serial data
SDATA
12
I/O
SMBus serial data I/O terminal – serial data I/O for SMBus
STBY
15
I
Active low standby mode input
IC supply voltage – should be decoupled with external 0.1
μ
F capacitor
VDD
2
I
absolute maximum ratings over operating case temperature (see Note 1) (unless otherwise noted)
Input voltage on:
V
DD
supply terminal, V
(DDIN)
I/O terminals, V
(IOIN)
SMBus terminals, V
(SMBIN)
DXN terminal, V
(DXN)
–0.3 V to 6 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous power dissipation, P
D
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating case temperature range, T
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, T
stg
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Junction temperature, T
J
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature (soldering, 10 sec), T
(LEAD)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values are with respect to GND.
–0.3 V to V
DD
+ 0.3 V
–0.3 V to 6 V
–0.3 V to 0.8 V
–1 mA to 50 mA
–1 mA to 1 mA
SMBus input/output current, I
(SMBIN)
DXN input current, I
(DXN)
330 mW
–55
°
C to 125
°
C
–65
°
C to 165
°
C
150
°
C
300
°
C
recommended operating conditions
MIN
MAX
UNITS
Supply voltage, VDD
SMBus input high voltage, VIH
SMBus input low voltage, VIL
SMBus operating frequency, f(SCLK)
Operating ambient temperature, TA
3
3.6
V
2.2
V
0.8
V
10
100
kHz
°
C
0
85
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