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參數(shù)資料
| 型號： | THMC10SSOPDBQ |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | REMOTE/LOCAL TEMPERATURE MONITOR WITH SMBus INTERFACE |
| 中文描述： | 遠端/本地溫度監(jiān)測SMBus接口 |
| 文件頁數(shù)： | 14/20頁 |
| 文件大?。?/td> | 269K |
| 代理商： | THMC10SSOPDBQ |
THMC10
REMOTE/LOCAL TEMPERATURE MONITOR
WITH SMBus INTERFACE
SLIS089 – DECEMBER 1999
14
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
PRINCIPLES OF OPERATION
PC board layout considerations
Place the THMC10 as close as practical to the remote diode. In a noisy environment, such as a computer
motherboard, this distance can be 4 inches to 8 inches (typical) or more, as long as the worst noise sources
(such as CRTs, clock generators, memory buses, and ISA/PCI buses) are avoided.
Route the DXP–DXN lines away from the deflection coils of a CRT. Also, avoid routing the traces across
a fast memory bus which can easily introduce 30
°
C error even with good filtering. Otherwise, most noise
sources are fairly benign.
Route the DXP and DXN traces in parallel and in close proximity to each other, away from any high-voltage
traces such as 12 Vdc. Leakage currents from PC board contamination must be be taken into consideration,
since a 20-M
leakage path from DXP to ground causes about 1
°
C error.
Connect guard traces to GND on either side of the DXP–DXN traces (Figure 7). With guard traces in place,
routing near high-voltage traces is not an issue.
Route through as few vias and crossunders as possible to minimize copper/solder thermocouple effects.
When introducing a thermocouple, insure that both the DXP and the DXN paths have matching
thermocouples. In general, PC board induced thermocouples are not a serious problem. A copper-solder
thermocouple exhibits 3
μ
V/
°
C, and it takes about 200
μ
V of voltage error at DXP–DXN to cause a 1
°
C
measurement error. Hence, most parasitic thermocouple errors are swamped out.
Use wide traces. Narrow traces are more inductive and tend to pick up radiated noise. The 10-mil widths
and spacings recommended in Figure 7 are not absolutely necessary as they offer only a minor
improvement in leakage and noise, but usage is recommended where practical.
Copper can not be used as an EMI shield and only ferrous materials such as steel work well. Placing a
copper ground plane between the DXP–DXN traces and traces carrying high-frequency noise signals does
not help reduce EMI.
PC board layout checklist
Place the THMC10 as close as possible to the remote diode.
Keep traces away from high voltages (12 V bus).
Keep traces away from fast data/memory buses and CRTs.
Use recommended trace widths and spacings.
Place a ground plane under the traces.
Use guard traces flanking DXP and DXN and connecting to GND.
Place the noise filter and the 0.1-
μ
F V
DD
bypass capacitors close to the THMC10.
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