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參數(shù)資料
| 型號(hào)： | TFA9843J |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 2-channel audio amplifier (SE: 1 W to 20 W or BTL: 4 W to 40 W) |
| 中文描述： | 14 W, 2 CHANNEL, AUDIO AMPLIFIER, PZFM9 |
| 封裝： | POWER, PLASTIC, SOT-523-1, DIL-BENT-SIL, 9 PIN |
| 文件頁數(shù)： | 18/21頁 |
| 文件大?。?/td> | 142K |
| 代理商： | TFA9843J |
Philips Semiconductors
TFA9843J
2-channel audio amplifier (2 x SE or 1 x BTL)
Preliminary data
Rev. 02 — 19 January 2004
18 of 21
9397 750 12587
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
16. Soldering
16.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth
account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC
packages on a printed-circuit board.
16.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250
°
C or 265
°
C, depending on solder material applied, SnPb or
Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (T
stg(max)
).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
16.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300
°
C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400
°
C, contact may be up to 5 seconds.
16.4 Package related soldering information
[1]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Table 11:
Suitability of through-hole mount IC packages for dipping and wave
soldering methods
Soldering method
Dipping
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
[2]
Package
Wave
suitable
[1]
not suitable
suitable
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TFA9843J/N1,112 | 功能描述:音頻放大器 AUDIO AMP 2CH RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TFA9879 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Mono BTL class-D audio amplifier for portable applications with digital input |
| TFA9879HN/N1 | 制造商:NXP Semiconductors 功能描述:IC AMP AUDIO MONO 3W DBS17P |
| TFA9879HN/N1,118 | 功能描述:音頻放大器 ClassD 2.75W 2Channel 1.8V 5.7mA RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TFA9879HN/N1,157 | 功能描述:音頻放大器 ClassD 2.75W 2Channel 1.8V 5.7mA RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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