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參數(shù)資料
| 型號(hào)： | TFA9843J |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 2-channel audio amplifier (SE: 1 W to 20 W or BTL: 4 W to 40 W) |
| 中文描述： | 14 W, 2 CHANNEL, AUDIO AMPLIFIER, PZFM9 |
| 封裝： | POWER, PLASTIC, SOT-523-1, DIL-BENT-SIL, 9 PIN |
| 文件頁數(shù)： | 15/21頁 |
| 文件大小： | 142K |
| 代理商： | TFA9843J |
Philips Semiconductors
TFA9843J
2-channel audio amplifier (2 x SE or 1 x BTL)
Preliminary data
Rev. 02 — 19 January 2004
15 of 21
9397 750 12587
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
13.2.2
Power supply decoupling
Proper supply bypassing is critical for low-noise performance and high supply voltage
ripple rejection. The respective capacitor location should be as close as possible to
the device and grounded to the power ground. Proper power supply decoupling also
prevents oscillations.
For suppressing higher frequency transients (spikes) on the supply line a capacitor
with low ESR, typical 100 nF, has to be placed as close as possible to the device. For
suppressing lower frequency noise and ripple signals, a large electrolytic capacitor,
e.g. 1000
μ
F or greater, must be placed close to the device.
The bypass capacitor on pin SVR reduces the noise and ripple on the mid rail
voltage. For good THD and noise performance a low ESR capacitor is recommended.
13.3 Thermal behavior and heatsink calculation
The measured maximum thermal resistance of the IC package, R
th(j-mb)
, is 2.0 K/W.
A calculation for the heatsink can be made, with the following parameters:
T
amb(max)
= 60
°
C (example)
V
CC
= 18 V and R
L
= 4
(SE)
T
j(max)
= 150
°
C (specification)
R
th(tot)
is the total thermal resistance between the junction and the ambient including
the heatsink. This can be calculated using the maximum temperature increase
divided by the power dissipation:
R
th(tot)
= (T
j(max)
T
amb(max)
)/P
D
Fig 21. Printed-circuit board layout (single-sided); components view.
AUDIO POWER CS NIJMEGEN
2
IN2
+
IN1
+
MUTE
SB ON
TVA
TFA9843J
S
+
S
+
+VP
1
μ
F
1
μ
F
1000
μ
F
B
1
22
μ
F
10 k
10
k
MCE506
100 nF
150
μ
F
220
nF
220
nF
MODE
SGND
S
S
CIV
CIV
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TFA9843J/N1,112 | 功能描述:音頻放大器 AUDIO AMP 2CH RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TFA9879 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Mono BTL class-D audio amplifier for portable applications with digital input |
| TFA9879HN/N1 | 制造商:NXP Semiconductors 功能描述:IC AMP AUDIO MONO 3W DBS17P |
| TFA9879HN/N1,118 | 功能描述:音頻放大器 ClassD 2.75W 2Channel 1.8V 5.7mA RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TFA9879HN/N1,157 | 功能描述:音頻放大器 ClassD 2.75W 2Channel 1.8V 5.7mA RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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