- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄382581 > TEA5768HL (NXP SEMICONDUCTORS) Low-power FM stereo radio for handheld applications PDF資料下載
參數(shù)資料
| 型號： | TEA5768HL |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 接收器 |
| 英文描述： | Low-power FM stereo radio for handheld applications |
| 中文描述： | FM, AUDIO SINGLE CHIP RECEIVER, PQFP32 |
| 封裝： | 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-358-1, LQFP-32 |
| 文件頁數(shù)： | 32/36頁 |
| 文件大?。?/td> | 196K |
| 代理商： | TEA5768HL |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁當(dāng)前第32頁第33頁第34頁第35頁第36頁
2004 Sep 13
32
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
TEA5768HL
16 SOLDERING
16.1
Introduction to soldering surface mount
packages
Thistextgivesaverybriefinsighttoacomplextechnology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certainsurfacemountICs,butitisnotsuitableforfinepitch
SMDs. In these situations reflow soldering is
recommended.
16.2
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 seconds and 200 seconds
depending on heating method.
Typical reflow peak temperatures range from
215
°
C to 270
°
C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
below 225
°
C (SnPb process) or below 245
°
C (Pb-free
process)
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness
≥
2.5 mm
– for packages with a thickness < 2.5 mm and a
volume
≥
350 mm
3
so called thick/large packages.
below 240
°
C (SnPb process) or below 260
°
C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
16.3
Wave soldering
Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is
preferred
to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
Forpackageswithleadsonfoursides,thefootprintmust
be placed at a 45
°
angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250
°
C or 265
°
C, depending
on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
16.4
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
°
C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 seconds to 5 seconds
between 270
°
C and 320
°
C.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TEA5768 | single-chip FM stereo radio |
| TEA6101 | R-78xx-1.0 Series - Innoline Regulated DC-DC Converters; Output Voltage (Vdc): 3.3V; Output Current (A): 1.0A; Features: Efficiency up to 97%,Non isolated, no need for heatsinks; Pin-out compatible with LM78XX Linears; Low profile( L*W*H=11.5*8.5*17.5mm); Wide input range.(4.75V ~ 34V); Short circuit protection, Thermal shutdown; Non standard outputs available as specials between 1.5V ~15V; Low ripple and noise; ?L? version with 90?? pins |
| TEA6101T | |
| TEA6310 | Transient Voltage Suppressor Diodes |
| TEA6320TD | Tone/Volume/Balance Control |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TEA5768HL/V2,157 | 功能描述:調(diào)諧器 LO-PWR FM STEREO RoHS:否 制造商:NXP Semiconductors 功能: 噪聲系數(shù): 工作電源電壓: 最小工作溫度: 最大工作溫度: |
| TEA5768HL2FE | 功能描述:IC FM STEREO LOW POWER 32LQFP RoHS:是 類別:RF/IF 和 RFID >> RF 接收器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS 產(chǎn)品變化通告:Product Discontinuation 09/Jan/2012 標(biāo)準(zhǔn)包裝:50 系列:* 頻率:850MHz ~ 2.175GHz 靈敏度:- 數(shù)據(jù)傳輸率 - 最大:- 調(diào)制或協(xié)議:- 應(yīng)用:* 電流 - 接收:* 數(shù)據(jù)接口:PCB，表面貼裝 存儲容量:- 天線連接器:PCB，表面貼裝 特點(diǎn):- 電源電壓:4.75 V ~ 5.25 V 工作溫度:0°C ~ 85°C 封裝/外殼:40-WFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:40-TQFN-EP（6x6） 包裝:托盤 |
| TEA5768HLBD | 功能描述:調(diào)諧器 LO-PWR FM STEREO RADIO RoHS:否 制造商:NXP Semiconductors 功能: 噪聲系數(shù): 工作電源電壓: 最小工作溫度: 最大工作溫度: |
| TEA5777 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Low-power AM/FM stereo radio for handheld applications |
| TEA5777HL | 功能描述:調(diào)諧器 AM/FM STEREO RoHS:否 制造商:NXP Semiconductors 功能: 噪聲系數(shù): 工作電源電壓: 最小工作溫度: 最大工作溫度: |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。