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9397 750 13113
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 — 28 May 2004
24 of 27
Philips Semiconductors
TEA1532
GreenChip
II SMPS control IC
14.4 Package related soldering information
[1]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note(AN01026);
order a copy from your Philips Semiconductors sales office.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods
[3]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[4]
Hot bar soldering or manual soldering is suitable for PMFP packages.
[5]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
[6]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[7]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[8]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[9]
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Table 6:
Mounting
Suitability of IC packages for wave, reflow and dipping soldering methods
Package
[1]
Soldering method
Wave
Through-hole
mount
SDIP, SIL
Through-hole-
surface mount
Surface mount
BGA, LBGA, LFBGA,
SQFP, SSOP-T
[5]
, TFBGA,
VFBGA
DHVQFN, HBCC, HBGA,
HLQFP, HSQFP, HSOP,
HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
[7]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO,
VSSOP
Reflow
[2]
Dipping
suitable
DBS, DIP, HDIP, RDBS,
suitable
[3]
PMFP
[4]
not suitable
not
suitable
suitable
not suitable
not suitable
[6]
suitable
suitable
not recommended
[7] [8]
not recommended
[9]
suitable
suitable
suitable
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| TEA1532P | GreenChip SMPS control IC |
| TEA1532T | GreenChip SMPS control IC |
| TEA1654 | GreenChipII SMPS control IC |
| TEA1654T | GreenChipII SMPS control IC |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TEA1532AP/N1,112 | 功能描述:開關(guān)變換器、穩(wěn)壓器與控制器 GREENCHIP 2 RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開關(guān)頻率:1 MHz 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel |
| TEA1532APN | 功能描述:開關(guān)變換器、穩(wěn)壓器與控制器 GREENCHIP 2 RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開關(guān)頻率:1 MHz 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel |
| TEA1532AT/N1,118 | 功能描述:開關(guān)變換器、穩(wěn)壓器與控制器 GREENCHIP 2 RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開關(guān)頻率:1 MHz 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel |
| TEA1532AT/N1/DG,11 | 功能描述:開關(guān)變換器、穩(wěn)壓器與控制器 12V 170mA 63KHz RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開關(guān)頻率:1 MHz 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel |
| TEA1532AT/N1/DG,118 | 制造商:NXP Semiconductors 功能描述:Cut Tape |
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