參數(shù)資料
型號： TDGL003
廠商： Microchip Technology
文件頁數(shù)： 142/214頁
文件大小： 0K
描述： BOARD DEV CHIPKIT MAX32
標準包裝： 1
系列： PIC® 32MX
類型： MCU
適用于相關(guān)產(chǎn)品： MPLAB?，Arduino? Mega
所含物品： 板
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁第103頁第104頁第105頁第106頁第107頁第108頁第109頁第110頁第111頁第112頁第113頁第114頁第115頁第116頁第117頁第118頁第119頁第120頁第121頁第122頁第123頁第124頁第125頁第126頁第127頁第128頁第129頁第130頁第131頁第132頁第133頁第134頁第135頁第136頁第137頁第138頁第139頁第140頁第141頁當前第142頁第143頁第144頁第145頁第146頁第147頁第148頁第149頁第150頁第151頁第152頁第153頁第154頁第155頁第156頁第157頁第158頁第159頁第160頁第161頁第162頁第163頁第164頁第165頁第166頁第167頁第168頁第169頁第170頁第171頁第172頁第173頁第174頁第175頁第176頁第177頁第178頁第179頁第180頁第181頁第182頁第183頁第184頁第185頁第186頁第187頁第188頁第189頁第190頁第191頁第192頁第193頁第194頁第195頁第196頁第197頁第198頁第199頁第200頁第201頁第202頁第203頁第204頁第205頁第206頁第207頁第208頁第209頁第210頁第211頁第212頁第213頁第214頁
2011 Microchip Technology Inc.
DS61143H-page 33
PIC32MX3XX/4XX
2.5
ICSP Pins
The PGECx and PGEDx pins are used for In-Circuit
Serial Programming (ICSP) and debugging pur-
poses. It is recommended to keep the trace length
between the ICSP connector and the ICSP pins on the
device as short as possible. If the ICSP connector is
expected to experience an ESD event, a series resistor
is recommended, with the value in the range of a few
tens of Ohms, not to exceed 100 Ohms.
Pull-up resistors, series diodes and capacitors on the
PGECx and PGEDx pins are not recommended as they
will interfere with the programmer/debugger communi-
cations to the device. If such discrete components are
an application requirement, they should be removed
from the circuit during programming and debugging.
Alternately, refer to the AC/DC characteristics and tim-
ing requirements information in the respective device
Flash programming specification for information on
capacitive loading limits and pin input voltage high (VIH)
and input low (VIL) requirements.
Ensure that the “Communication Channel Select” (i.e.,
PGECx/PGEDx pins) programmed into the device
matches the physical connections for the ICSP to
MPLAB ICD 2, MPLAB ICD 3 or MPLAB REAL ICE.
For more information on ICD 2, ICD 3 and REAL ICE
connection
requirements,
refer
to
the
following
documents that are available on the Microchip web
site.
“MPLAB ICD 2 In-Circuit Debugger User’s
Guide” DS51331
“Using MPLAB ICD 2” (poster) DS51265
“MPLAB ICD 2 Design Advisory” DS51566
“Using MPLAB ICD 3” (poster) DS51765
“MPLAB ICD 3 Design Advisory” DS51764
“MPLAB REAL ICE In-Circuit Debugger
User’s Guide” DS51616
“Using MPLAB REAL ICE” (poster) DS51749
2.6
JTAG
The TMS, TDO, TDI and TCK pins are used for testing
and debugging according to the Joint Test Action
Group (JTAG) standard. It is recommended to keep the
trace length between the JTAG connector and the
JTAG pins on the device as short as possible. If the
JTAG connector is expected to experience an ESD
event, a series resistor is recommended, with the value
in the range of a few tens of Ohms, not to exceed 100
Ohms.
Pull-up resistors, series diodes and capacitors on the
TMS, TDO, TDI and TCK pins are not recommended
as they will interfere with the programmer/debugger
communications to the device. If such discrete compo-
nents are an application requirement, they should be
removed from the circuit during programming and
debugging. Alternately, refer to the AC/DC characteris-
tics and timing requirements information in the respec-
tive device Flash programming specification for
information on capacitive loading limits and pin input
voltage high (VIH) and input low (VIL) requirements.
2.7
Trace
The trace pins can be connected to a hardware-trace-
enabled programmer to provide a compress real time
instruction trace. When used for trace the TRD3,
TRD2, TRD1, TRD0 and TRCLK pins should be dedi-
cated for this use. The trace hardware requires a 22
Ohm series resistor between the trace pins and the
trace connector.
2.8
External Oscillator Pins
Many MCUs have options for at least two oscillators: a
high-frequency primary oscillator and a low-frequency
secondary oscillator (refer to Section 8.0 “Oscillator
Configuration” for details).
The oscillator circuit should be placed on the same
side of the board as the device. Also, place the
oscillator circuit close to the respective oscillator pins,
not
exceeding
one-half
inch
(12 mm)
distance
between them. The load capacitors should be placed
next to the oscillator itself, on the same side of the
board. Use a grounded copper pour around the
oscillator circuit to isolate them from surrounding
circuits. The grounded copper pour should be routed
directly to the MCU ground. Do not run any signal
traces or power traces inside the ground pour. Also, if
using a two-sided board, avoid any traces on the
other side of the board where the crystal is placed. A
suggested layout is illustrated in Figure 2-3.
FIGURE 2-3:
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
Main Oscillator
Guard Ring
Guard Trace
Secondary
Oscillator
相關(guān)PDF資料
PDF描述
3-1435834-0 PATCHCORD CAT6 AMPTRAC WHITE 30'
DM164130-5 BOARD EVAL F1 LV PIC21F1/PIC16F1
DM164130-1 BOARD EVAL PICKIT PIC16LF1937
TDGL002 BOARD DEV CHIPKIT UNO32
MAX16024LTBS25+T IC BATTERY BACKUP 2.5V 10TDFN-EP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TDGL004 功能描述:BOARD CEREBOT 32MX7 PIC32MX795 RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 通用嵌入式開發(fā)板和套件（MCU、DSP、FPGA、CPLD等） 系列:PIC® 32MX 產(chǎn)品培訓(xùn)模塊:Blackfin® Processor Core Architecture Overview Blackfin® Device Drivers Blackfin® Optimizations for Performance and Power Consumption Blackfin® System Services 特色產(chǎn)品:Blackfin? BF50x Series Processors 標準包裝:1 系列:Blackfin® 類型:DSP 適用于相關(guān)產(chǎn)品:ADSP-BF548 所含物品:板，軟件，4x4 鍵盤，光學(xué)撥輪，QVGA 觸摸屏 LCD 和 40G 硬盤 配用:ADZS-BFBLUET-EZEXT-ND - EZ-EXTENDER DAUGHTERBOARDADZS-BFLLCD-EZEXT-ND - BOARD EXT LANDSCAP LCD INTERFACE 相關(guān)產(chǎn)品:ADSP-BF542BBCZ-4A-ND - IC DSP 16BIT 400MHZ 400CSBGAADSP-BF544MBBCZ-5M-ND - IC DSP 16BIT 533MHZ MDDR 400CBGAADSP-BF542MBBCZ-5M-ND - IC DSP 16BIT 533MHZ MDDR 400CBGAADSP-BF542KBCZ-6A-ND - IC DSP 16BIT 600MHZ 400CSBGAADSP-BF547MBBCZ-5M-ND - IC DSP 16BIT 533MHZ MDDR 400CBGAADSP-BF548BBCZ-5A-ND - IC DSP 16BIT 533MHZ 400CSBGAADSP-BF547BBCZ-5A-ND - IC DSP 16BIT 533MHZ 400CSBGAADSP-BF544BBCZ-5A-ND - IC DSP 16BIT 533MHZ 400CSBGAADSP-BF542BBCZ-5A-ND - IC DSP 16BIT 533MHZ 400CSBGA
TDGL005 功能描述:子卡和OEM板 chipKIT Basic I/O Shield RoHS:否 制造商:BeagleBoard by CircuitCo 產(chǎn)品:BeagleBone LCD4 Boards 用于:BeagleBone - BB-Bone - Open Source Development Kit
TDGL006 功能描述:界面開發(fā)工具 chipKIT Network Shield RoHS:否 制造商:Bourns 產(chǎn)品:Evaluation Boards 類型:RS-485 工具用于評估:ADM3485E 接口類型:RS-485 工作電源電壓:3.3 V
TDGL007 功能描述:開發(fā)板和工具包 - PIC / DSPIC DIGILENT CEREBOT MC7 MOTOR CONTROL BRD RoHS:否 制造商:Microchip Technology 產(chǎn)品:Starter Kits 工具用于評估:chipKIT 核心:Uno32 接口類型: 工作電源電壓:
TDGL008 功能描述:開發(fā)板和工具包 - PIC / DSPIC Digilent Cerebot MX3ck Dev Brd RoHS:否 制造商:Microchip Technology 產(chǎn)品:Starter Kits 工具用于評估:chipKIT 核心:Uno32 接口類型: 工作電源電壓:
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*