參數(shù)資料
型號: TDGL003
廠商: Microchip Technology
文件頁數(shù): 140/214頁
文件大小: 0K
描述: BOARD DEV CHIPKIT MAX32
標準包裝: 1
系列: PIC® 32MX
類型: MCU
適用于相關(guān)產(chǎn)品: MPLAB?,Arduino? Mega
所含物品:
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2011 Microchip Technology Inc.
DS61143H-page 31
PIC32MX3XX/4XX
2.0
GUIDELINES FOR GETTING
STARTED WITH 32-BIT
MICROCONTROLLERS
2.1
Basic Connection Requirements
Getting started with the PIC32MX3XX/4XX family of
32-bit Microcontrollers (MCUs) requires attention to a
minimal
set
of
device
pin
connections
before
proceeding with development. The following is a list of
pin names, which must always be connected:
All VDD and VSS pins
All AVDD and AVSS pins (regardless if ADC module
is not used)
VCAP/VCORE
MCLR pin
PGECx/PGEDx pins used for In-Circuit Serial
Programming (ICSP) and debugging purposes
OSC1 and OSC2 pins when external oscillator
source is used
Additionally, the following pins may be required:
VREF+/VREF- pins used when external voltage
reference for ADC module is implemented
2.2
Decoupling Capacitors
The use of decoupling capacitors on every pair of
power supply pins, such as VDD, VSS, AVDD and
AVSS is required. See Figure 2-1.
Consider the following criteria when using decoupling
capacitors:
Value and type of capacitor: Recommendation
of 0.1 F (100 nF), 10-20V. This capacitor should
be a low-ESR and have resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
Placement on the printed circuit board: The
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
Handling high frequency noise: If the board is
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 F to 0.001 F. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 F in parallel with 0.001 F.
Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
Note 1: This data sheet summarizes the features
of
the
PIC32MX3XX/4XX
family
of
devices. It is not intended to be a
comprehensive
reference
source.
To
complement the information in this data
sheet,
refer
to
the
“PIC32
Family
Reference Manual”, which is available
from
the
Microchip
web
site
(www.microchip.com/PIC32).
2: Some
registers
and
associated
bits
described in this section may not be avail-
able on all devices. Refer to Section 4.0
sheet for device-specific register and bit
information.
Note:
The AVDD and AVSS pins must be
connected independent of ADC use and
ADC voltage reference source.
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