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參數(shù)資料
| 型號： | TDA9964HL |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | ADC |
| 英文描述： | 12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras |
| 中文描述： | 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP48 |
| 封裝： | 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-313-2, LQFP-48 |
| 文件頁數(shù)： | 20/24頁 |
| 文件大小： | 109K |
| 代理商： | TDA9964HL |
2000 May 02
20
Philips Semiconductors
Objective specification
12-bit, 3.0 V, 30 Msps analog-to-digital
interface for CCD cameras
TDA9964
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
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| TDA9965AHL | 12-bit, 5.0 V, 40 Msps analog-to-digital interface for CCD cameras |
| TDD1742T | CMOS FREQUENCY SYNTHESIZER |
| TDF5140 | Brushless DC motor drive circuit |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TDA9965 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:12-bit, 5.0 V, 30 Msps analog-to-digital interface for CCD cameras |
| TDA9965A | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:12-bit, 5.0 V, 40 Msps analog-to-digital interface for CCD cameras |
| TDA9965AHL | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:12-bit, 5.0 V, 40 Msps analog-to-digital interface for CCD cameras |
| TDA9965AHL/C3,118 | 功能描述:CCD CAMERA INTERFACE 48LQFP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - ADCs/DAC - 專用型 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:50 系列:- 類型:數(shù)據(jù)采集系統(tǒng)（DAS） 分辨率（位）:16 b 采樣率（每秒）:21.94k 數(shù)據(jù)接口:MICROWIRE?，QSPI?，串行，SPI? 電壓電源:模擬和數(shù)字 電源電壓:1.8 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:40-WFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:40-TQFN-EP（6x6） 包裝:托盤 |
| TDA9965AHL/C3,151 | 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 12B 5V 40MSPS ANALOG TO-DIGITAL INTERFACE RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32 |
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