參數(shù)資料
型號(hào)： TDA9818T
廠(chǎng)商： NXP SEMICONDUCTORS
元件分類(lèi)： 接收器
英文描述： Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
中文描述： AM/FM, AUDIO/VIDEO DEMODULATOR, PDSO24
封裝： 7.50 MM, PLASTIC, SOT-137-1, MS-013, SOP-24
文件頁(yè)數(shù)： 39/41頁(yè)
文件大?。?/td> 240K
代理商： TDA9818T
2004 Jun 29
39
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
TDA9817; TDA9818
Suitability of IC packages for wave, reflow and dipping soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
Hot bar soldering or manual soldering is suitable for PMFP packages.
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
10. Hot bar or manual soldering is suitable for PMFP packages.
11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
2.
3.
4.
5.
6.
7.
8.
9.
MOUNTING
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
DIPPING
not suitable
Through-hole mount CPGA, HCPGA
suitable
suitable
(3)
not suitable
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
(4)
Through-hole-
surface mount
Surface mount
BGA, HTSSON..T
(5)
, LBGA, LFBGA, SQFP,
SSOP-T
(5)
, TFBGA, USON, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSO,
HSOP, HSQFP, HSSON, HTQFP, HTSSOP,
HVQFN, HVSON, SMS
PLCC
(7)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L
(11)
, PMFP
(10)
, WQCCN32L
(11)
not suitable
suitable
not suitable
(6)
suitable
suitable
not recommended
(7)(8)
not recommended
(9)
not suitable
suitable
suitable
suitable
not suitable
相關(guān)PDF資料
PDF描述
TDA9817TS Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
TDA9817T Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
TDA9818TS Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
TDA9819T Multistandard vision and sound-IF PLL with DVB-IF processing
TDA9819 Multistandard Vision And Sound-IF PLL With DVB-IF Processing(帶數(shù)字視頻廣播-中頻（DVB-IF）處理的多標(biāo)準(zhǔn)視覺(jué)及聲音-中頻（IF）的 PLL)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TDA9818T/V1,118 功能描述:IC FM-PLL/AM DEMOD 24-SOIC RoHS:是 類(lèi)別:集成電路 (IC) >> 線(xiàn)性 - 視頻處理 系列:- 產(chǎn)品變化通告:Product Discontinuation 07/Mar/2011 標(biāo)準(zhǔn)包裝:3,000 系列:OMNITUNE™ 類(lèi)型:調(diào)諧器 應(yīng)用:移動(dòng)電話(huà)，手機(jī)，視頻顯示器 安裝類(lèi)型:表面貼裝 封裝/外殼:65-WFBGA 供應(yīng)商設(shè)備封裝:PG-WFSGA-65 包裝:帶卷 (TR) 其它名稱(chēng):SP000365064
TDA9818TS 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
TDA9819 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Multistandard vision and sound-IF PLL with DVB-IF processing
TDA9819T 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Multistandard vision and sound-IF PLL with DVB-IF processing
TDA9820 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Multistandard/dual channel TV FM intercarrier sound demodulator
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