參數(shù)資料
型號(hào)： TDA8768BH/5/C3
廠商： NXP SEMICONDUCTORS
元件分類： ADC
英文描述： 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP44
封裝： 10 X 10 MM, 1.75 MM HEIGHT, 1.30 MM LEAD LENGTH, PLASTIC, SOT-307-2, QFP-44
文件頁(yè)數(shù)： 19/30頁(yè)
文件大?。?/td> 547K
代理商： TDA8768BH/5/C3
Philips Semiconductors
TDA8768B
12-bit, 80 Msps Analog-to-Digital Converter (ADC)
Product data
Rev. 02 — 20 January 2004
26 of 30
9397 750 12338
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
To overcome these problems the double-wave soldering method was specically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
° angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be xed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250
°C or
265
°C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated ux will eliminate the need for removal of corrosive residues in
most applications.
15.4 Manual soldering
Fix the component by rst soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the at part of the lead. Contact time
must be limited to 10 seconds at up to 300
°C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°C.
15.5 Package related soldering information
Table 10:
Suitability of surface mount IC packages for wave and reow soldering
methods
Package[1]
Soldering method
Wave
Reow[2]
BGA, HTSSON..T[3], LBGA, LFBGA, SQFP,
SSOP..T[3], TFBGA, USON, VFBGA
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable[4]
suitable
PLCC[5], SO, SOJ
suitable
相關(guān)PDF資料
PDF描述
TDA8768BH/8/C3/S1 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP44
TDA8768BH/8/C3 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP44
TDA8769HW/10 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP48
TDA8769HW/6 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP48
TDA8769HW/8 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP48
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