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參數(shù)資料
| 型號： | TDA8768BH/5/C3 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | ADC |
| 英文描述： | 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP44 |
| 封裝： | 10 X 10 MM, 1.75 MM HEIGHT, 1.30 MM LEAD LENGTH, PLASTIC, SOT-307-2, QFP-44 |
| 文件頁數(shù)： | 18/30頁 |
| 文件大小： | 547K |
| 代理商： | TDA8768BH/5/C3 |
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Philips Semiconductors
TDA8768B
12-bit, 80 Msps Analog-to-Digital Converter (ADC)
Product data
Rev. 02 — 20 January 2004
25 of 30
9397 750 12338
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
14. Handling information
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be completely safe, it is desirable to take normal precautions appropriate
to handling integrated circuits.
15. Soldering
15.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for ne
pitch SMDs. In these situations reow soldering is recommended. In these situations
reow soldering is recommended.
15.2 Reow soldering
Reow soldering requires solder paste (a suspension of ne solder particles, ux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reow peak temperatures range from 215 to 270
°C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
below 225
°C (SnPb process) or below 245 °C (Pb-free process)
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness
≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume
≥ 350 mm3 so called
thick/large packages.
below 240
°C (SnPb process) or below 260 °C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.
15.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
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