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參數(shù)資料
| 型號(hào)： | TDA8591J |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 4 X 44 W into 4 or 4 X 75 W into 2 quad BTL car radio power amplifier |
| 中文描述： | 47 W, 4 CHANNEL, AUDIO AMPLIFIER, PZFM27 |
| 封裝： | PLASTIC, DIL-BENT-SIL, 27 PIN |
| 文件頁數(shù)： | 32/36頁 |
| 文件大小： | 295K |
| 代理商： | TDA8591J |
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2002 Jan 14
32
Philips Semiconductors
Preliminary specification
4
×
44 W into 4
or 4
×
75 W into 2
quad BTL car radio power amplifier
TDA8591J
16 SOLDERING
16.1
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering.Amorein-depth account ofsoldering ICscanbe
found in our “Data Handbook IC26; Integrated Circuit
Packages”(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
16.2
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260
°
C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
Thetotalcontacttimeofsuccessivesolderwavesmustnot
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
16.3
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
°
C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
°
C, contact may be up to 5 seconds.
16.4
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Note
1.
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
PACKAGE
SOLDERING METHOD
DIPPING
WAVE
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable
(1)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TDA8591J/N1,112 | 功能描述:音頻放大器 4 X 44 W INTO 4 OHM OR 4 X 75 RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TDA8594 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I2C-bus controlled 4 X 50 W power amplifier |
| TDA8594J | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I2C-bus controlled 4 X 50 W power amplifier |
| TDA8594J/N1 | 功能描述:音頻放大器 AMPLIFIER 4X50W RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TDA8594J/N1,112 | 制造商:NXP Semiconductors 功能描述: |
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