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參數(shù)資料
| 型號(hào)： | TDA8260 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Satellite Zero-IF QPSK/8PSK downconverter with PLL synthesizer |
| 中文描述： | 衛(wèi)星零中頻QPSK/8PSK與PLL合成器變頻器 |
| 文件頁(yè)數(shù)： | 3/23頁(yè) |
| 文件大小： | 143K |
| 代理商： | TDA8260 |
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2004 Sep 03
3
Philips Semiconductors
Product specification
Satellite Zero-IF QPSK/8PSK
downconverter with PLL synthesizer
TDA8260TW
Performance summary
TDA8260TW performance:
Noise figure at maximum gain = +18 dB
High linearity; IP2 = +19 dBm and IP3 = +14 dBm
Low phase noise on baseband outputs:
78 dBc/Hz (f
offset
= 1 and 10 kHz; f
COMP
= 1 MHz)
0 to 50 dB variable gain with AGC control
AGC linearity <1 dB/bit with an 8-bit DAC
Maximum I-to-Q amplitude mismatch = 1 dB
Maximum I-to-Q phase mismatch = 3
°
Signal rates from 1 to 45 MSymbol/s.
System performance, for example, in a tuner application
with the IC placed after a low-cost discrete LNA
(see Fig.11):
Noise figure at maximum gain = 8 dB
High linearity; IP2 = +15 dBm and IP3 = +5 dBm
0 to 50 dB variable gain with AGC control.
Specification limitation
The content of this specification is applies to the device
TDA8260TW with versions C2 and above. Version C1 is
not covered by this document. Please contact your Philips
semiconductors representative for further information.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
CC
I
CC
f
osc
Eq
supply voltage
supply current
oscillator frequency
quadrature error (absolute value)
4.75
950
5.0
155
0
5.25
2175
3
V
mA
MHz
deg
V
AGC
= 1.5 V;
V
o(p-p)
= 750 mV;
measured in baseband
V
o(p-p)
recommended output voltage
(peak-to-peak value)
LPF cut-off frequency
phase noise on baseband outputs f
offset
= 1 and 10 kHz;
750
mV
LPF
CO
n
36
78
MHz
dBc/Hz
f
COMP
= 1 MHz with
appropriate loop filter and
charge pump setting
V
AGC
= 0 to 3 V
T
2
= 1, T
1
= 0, T
0
= 0;
driving a load of
C
L
= 10 pF, R
L
= 1 M
G
v
V
XTOUT(p-p)
AGC range
AC output voltage on pin XTOUT
(peak-to-peak value)
48
500
50
650
dB
mV
T
amb
ambient temperature
20
+85
°
C
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA8260TW
HTSSOP38 plastic thermal enhanced thin shrink small outline package; 38 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
SOT633-3
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