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參數(shù)資料
| 型號： | TDA4863 |
| 廠商： | INFINEON TECHNOLOGIES AG |
| 英文描述： | Boost Controller |
| 中文描述： | 升壓控制器 |
| 文件頁數(shù)： | 15/20頁 |
| 文件大?。?/td> | 105K |
| 代理商： | TDA4863 |
2000 Aug 17
15
Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
SOLDERING
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering.Amorein-depth account ofsoldering ICscanbe
found in our “Data Handbook IC26; Integrated Circuit
Packages”(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260
°
C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
Thetotalcontacttimeofsuccessivesolderwavesmustnot
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
°
C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
°
C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Note
1.
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
PACKAGE
SOLDERING METHOD
DIPPING
WAVE
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable
(1)
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| TDA4863_05 | 制造商:INFINEON 制造商全稱:Infineon Technologies AG 功能描述:Power Factor Controller IC for High Power Factor and Low THD |
| TDA48632 | 功能描述:功率因數(shù)校正 IC RoHS:否 制造商:Fairchild Semiconductor 開關(guān)頻率:300 KHz 最大功率耗散: 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Reel |
| TDA4863-2 | 功能描述:功率因數(shù)校正 IC BOOST CONTROLLER FOR HI PWR FACTOR/LW THD RoHS:否 制造商:Fairchild Semiconductor 開關(guān)頻率:300 KHz 最大功率耗散: 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Reel |
| TDA4863-2_05 | 制造商:INFINEON 制造商全稱:Infineon Technologies AG 功能描述:Power-Factor Controller (PFC) IC for High Power Factor and Low THD |
| TDA48632G | 功能描述:功率因數(shù)校正 IC RoHS:否 制造商:Fairchild Semiconductor 開關(guān)頻率:300 KHz 最大功率耗散: 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Reel |
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