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參數(shù)資料
| 型號： | TC9402EJD |
| 廠商： | Microchip Technology |
| 文件頁數(shù)： | 21/28頁 |
| 文件大?。?/td> | 545K |
| 描述： | IC V-FREQ/FREQ-V CONV 14CDIP |
| 標準包裝： | 29 |
| 類型： | 電壓至頻率和頻率至電壓 |
| 頻率 - 最大： | 100kHz |
| 全量程： | ±100ppm/°C |
| 線性： | ±0.25% |
| 安裝類型： | 通孔 |
| 封裝/外殼： | 14-CDIP（0.300"，7.62mm） |
| 供應商設備封裝： | 14-CERDIP |
| 包裝： | 管件 |
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?2007 Microchip Technology Inc.
DS21483D-page 21
TC9400/9401/9402
14-Lead Plastic Small Outline (OD) Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. ?Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC:Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits MIN
NOM
MAX
Number of Pins
N
14
Pitch
e
1.27 BSC
Overall Height
A
1.75
Molded Package Thickness
A2 1.25
Standoff ?/DIV>
A1 0.10
0.25
Overall Width
E
6.00 BSC
Molded Package Width
E1
3.90 BSC
Overall Length
D
8.65 BSC
Chamfer (optional)
h 0.25
0.50
Foot Length
L 0.40
1.27
Footprint
L1
1.04 REF
Foot Angle
?/DIV>
0?/DIV>
8?/DIV>
Lead Thickness
c 0.17
0.25
Lead Width
b 0.31
0.51
Mold Draft Angle Top
?/DIV>
5?/DIV>
15?/DIV>
Mold Draft Angle Bottom
?/DIV>
5?/DIV>
15?/DIV>
NOTE 1
N
D
E
E1
1
2 3
b
e
A
A1
A2
L
L1
c
h
h
?/DIV>
?/DIV>
?/DIV>
MicrochipTechnologyDrawingC04-065B
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