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參數(shù)資料
| 型號(hào)： | TC9402EJD |
| 廠商： | Microchip Technology |
| 文件頁數(shù)： | 20/28頁 |
| 文件大?。?/td> | 545K |
| 描述： | IC V-FREQ/FREQ-V CONV 14CDIP |
| 標(biāo)準(zhǔn)包裝： | 29 |
| 類型： | 電壓至頻率和頻率至電壓 |
| 頻率 - 最大： | 100kHz |
| 全量程： | ±100ppm/°C |
| 線性： | ±0.25% |
| 安裝類型： | 通孔 |
| 封裝/外殼： | 14-CDIP（0.300"，7.62mm） |
| 供應(yīng)商設(shè)備封裝： | 14-CERDIP |
| 包裝： | 管件 |
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TC9400/9401/9402
DS21483D-page 20
?2007 Microchip Technology Inc.
14-Lead Plastic Dual In-Line (PD) 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
. ?Significant Characteristic.
. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
INCHES
Dimension Limits MIN
NOM
MAX
Number of Pins
N
14
Pitch
e
.100 BSC
Top to Seating Plane
A
.210
Molded Package Thickness
A2 .115
.130
.195
Base to Seating Plane
A1 .015
Shoulder to Shoulder Width
E .290
.310
.325
Molded Package Width
E1 .240
.250
.280
Overall Length
D .735
.750
.775
Tip to Seating Plane
L .115
.130
.150
Lead Thickness
c .008
.010
.015
Upper Lead Width
b1 .045
.060
.070
Lower Lead Width
b .014
.018
.022
Overall Row Spacing ?/DIV>
eB
.430
N
E1
D
NOTE 1
1 2
3
E
c
eB
A2
L
A
A1
b1
b
e
MicrochipTechnologyDrawingC04-005B
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