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參數(shù)資料
| 型號： | TC6400IUD-20#TRPBF |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | ADC |
| 英文描述： | 1-CH 16-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC16 |
| 封裝： | 3 X 3 MM, 0.75 MM HEIGHT, LEAD FREE, PLASTIC, MO-220WEED-2, QFN-16 |
| 文件頁數(shù)： | 7/16頁 |
| 文件大?。?/td> | 234K |
| 代理商： | TC6400IUD-20#TRPBF |
LTC6400-20
15
640020p
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
3.00
± 0.10
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.45
± 0.05
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40
± 0.10
BOTTOM VIEW—EXPOSED PAD
1.45
± 0.10
(4-SIDES)
0.75
± 0.05
R = 0.115
TYP
0.25
± 0.05
1
PIN 1 NOTCH R = 0.20 TYP
OR 0.25
× 45° CHAMFER
15
16
2
0.50 BSC
0.200 REF
2.10
± 0.05
3.50
± 0.05
0.70
±0.05
0.00 – 0.05
(UD16) QFN 0904
0.25
±0.05
0.50 BSC
PACKAGE
OUTLINE
UD Package
16-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1691)
TYPICAL APPLICATIONS
Test Circuit B, 4-Port Analysis
0.1
μF
13
640020 TA02
1
V+
2
VOCM
14
7
15
+OUT
+OUTF
–OUTF
–OUT
+IN
IN+
OUT–
IN–
OUT+
+IN
–IN
5
16
RG
100
Ω
ROUT
12.5
Ω
RF
1000
Ω
RG
100
Ω
RF
1000
Ω
6
4
V–
3
V+
VOCM
V+
12
V–
11
ENABLE
9
V–
10
V+
COMMON
MODE CONTROL
1/2
AGILENT
E5O71C
BIAS CONTROL
8
ROUT
12.5
Ω
37.4
Ω
37.4
Ω
RFILT
50
Ω
RFILT
50
Ω
CFILT
2.7pF
1000pF
0.1
μF
0.1
μF
0.1
μF
PORT 3
(50
Ω)
PORT 4
(50
Ω)
1/2
AGILENT
E5O71C
200
Ω
0.1
μF
0.1
μF
PORT 1
(50
Ω)
PORT 2
(50
Ω)
0.1
μF
1000pF
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